Mechanical Design Engineer - Mountain View, CA, United States
$135,000 USD yearly
Originally posted 13 May 2026 by the employer.
About the role
As a Mechanical Design Engineer on the Packaging team, you will be responsible for package stack-up analysis, co-optimizing mechanical, optical, and thermal aspects that influence package form factors, and driving socket/enabling mechanisms. You will run parametric design studies and execute tolerance stack-up analyses to influence upstream package and system design.
What you'll do
- Create CAD models of package stack-up and associated components. - Perform mechanical design analysis to identify and implement solutions that improve package mechanical integrity. - Execute tolerance stack-up analyses and create GD&T drawings for advanced packages, including optically aligned assemblies. - Apply manufacturing expertise to influence design choices, perform FMEAs, and evaluate the cost implications of process and design decisions. - Collaborate with package and systems teams to ensure packaging solutions comply with system boundary conditions.
What you'll need
- BS or MS in Mechanical Engineering or a related field. - Minimum of 3 years of mechanical design experience in semiconductor packaging, optoelectronics, or photonics modules. - Proficiency in CAD tools such as Solidworks or Creo, with a focus on mechanical design best practices. - Expertise in Geometric Dimensioning and Tolerancing (GD&T) and tolerance stack-up analysis. - Experience managing prototype builds with external vendors, validating designs, and ensuring scalability to high-volume manufacturability. - Working knowledge of semiconductor packaging technologies, including the mechanical and thermal trade-offs of 3D, 2.5D, and FCBGA architectures.
Nice to have
- Knowledge of ASME Y14.5 standards. - Working knowledge of FEA tools (ANSYS, Abaqus, or similar) for structural and thermal analysis. - Fiber array unit (FAU) attach, optical connector, or photonic alignment experience. - Experience with liquid cooling or advanced thermal architectures for AI/HPC systems. - Exposure to high-volume manufacturing and OSAT engagement in Asia.
This role has been open 163 days — well above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1017
|
Median days open
51 d
|
Median salary
$154k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lightmatter | All employers we track in this specialty (1017 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 1017 |
| Open roles in the wider Software, Firmware & Systems family | 15 | 6277 · 144 employers |
| Median days open | 68 d | 51 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $154k |
Who's hiring in this category
- Intel Corporation · 75 open roles · median 36 d
- KLA Corporation · 63 open roles · median 50 d
- Teradyne · 61 open roles · median 36 d
- NVIDIA · 51 open roles · median 68 d
- Applied Materials · 48 open roles · median 67 d
- AMD · 43 open roles · median 53 d
How we counted: 1017 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.