$85,000 - $146,000 USD yearly
Originally posted 18 September 2026 by the employer — open 1 day.
About the role
This role develops products and optimizes advanced manufacturing processes for semiconductor packaging and thermal management applications, focusing on the integration of ceramic and diamond materials with semiconductor components through bonding and other joining methods.
What you'll do
- Support the development and manufacturing of products and materials used in advanced semiconductor packaging, including thermal spreaders and advanced ceramic and diamond materials.
- Design and execute experiments to support process development, characterization, and qualification activities.
- Develop and optimize joining and bonding processes for ceramic and diamond materials, including surface preparation, cleaning, polishing, plasma treatment, metallization, bonding, soldering, brazing, and other interfacial technologies.
- Operate, qualify, and maintain manufacturing and characterization equipment used in process development activities.
- Perform materials and surface characterization using metrology and analytical tools to assess mechanical, physical, thermal, and bond-interface properties.
- Analyze technical data to assess process performance, identify improvement opportunities, and support engineering decisions.
What you'll need
- Bachelor's degree in materials science and engineering, mechanical engineering, chemical engineering, semiconductor engineering, thermal engineering, or a related technical discipline.
- Minimum of 5 years of related experience with a Bachelor's degree; or 3 years and a Master's degree; or a PhD without years experience; or equivalent work experience.
- Knowledge of advanced materials, including ceramic and diamond materials, thermal management materials, and related engineered material systems.
- Experience with process development, optimization, and characterization in an R&D or advanced manufacturing environment.
- Understanding of semiconductor fabrication processes and surface preparation techniques.
- Proficiency with metrology and characterization tools for thermal, mechanical, and physical measurements.
- Knowledge of statistical analysis methods and familiarity with JMP or similar software.
Nice to have
- Master's degree in a related engineering or scientific discipline.
- Experience in process development, materials engineering, semiconductor manufacturing, advanced manufacturing, or a related technical field.
- Experience with advanced materials processing, ceramic or diamond bonding, direct bonding technologies, semiconductor fabrication, thermal management materials, or process characterization techniques.
Skills: advanced semiconductor packaging, joining and bonding processes, ceramic and diamond materials, process development, materials and surface characterization
This role has been open 0 days — well below the 80-day median for Process Engineering roles.
Process Engineering · Semiconductor Process
|
Open roles in category
1040
|
Median days open
80 d
|
Median salary
$148k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Coherent Corp | All employers we track in this specialty (1040 roles · 60 employers) |
|---|---|---|
| Open roles in this specialty | 23 | 1040 |
| Open roles in the wider Process, Fab & Equipment family | 133 | 9328 · 108 employers |
| Median days open | 120 d | 80 d (+40 d vs this employer) |
| Median salary (USD postings) | — | $148k |
Skills observed across this category: advanced semiconductor packaging, joining and bonding processes, ceramic and diamond materials, process development, materials and surface characterization
Who's hiring in this category
- Micron Technology · 346 open roles · median 135 d
- Applied Materials · 88 open roles · median 136 d
- GlobalFoundries · 70 open roles · median 88 d
- STMicroelectronics · 46 open roles · median 65 d
- Texas Instruments · 45 open roles · median 31 d
- Entegris · 42 open roles · median 26 d
How we counted: 1040 open Process Engineering (Semiconductor Process) roles from 60 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.