Manufacturing Engineer Packaging & OSAT - 新北市, New Taipei City, Taiwan
Originally posted 16 September 2026 by the employer — open 2 days.
About the role
This role involves managing the manufacturing interface across package design, semiconductor assembly, package test, board assembly, and final product integration.
What you'll do
- Translate package requirements into assembly process flows, manufacturing specifications, control plans, and documentation.
- Lead factory commissioning, line bring-up, pilot builds, qualification lots, and mass-production readiness reviews.
- Establish process capability and performance targets including Cp/Cpk, yield, FPY, defect rates, test escapes, cycle time, and OEE.
- Apply structured methods such as SPC, DOE, PFMEA, 8D, CAPA, and data-driven problem solving to improve results.
- Own technical issue resolution and controlled change implementation across silicon, package, assembly, test, and factory operations.
What you'll need
- 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, or NPI.
- Experience with semiconductor assembly, package manufacturing, package test, board assembly, or final product manufacturing.
- Ability to work with OSATs, substrate and bumping suppliers, test houses, and contract manufacturers.
- Proficiency in interpreting package drawings, BGA maps, BOMs, PCB data, process and quality reports, reliability results, and manufacturing documentation.
- Experience driving decisions across engineering, operations, quality, and suppliers.
This role has been open 2 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Tenstorrent | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 5 | 9358 · 108 employers |
| Median days open | 2 d | 53 d (−51 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.