Lead Engineer, Packaging Project
Originally posted 4 September 2026 by the employer.
About the role
This role involves making critical decisions on package design, leading assembly process engineering, and driving problem-solving and optimization for packaging projects.
What you'll do
- Independently manage and execute assigned packaging projects within scope, budget, and schedule.
- Serve as a packaging and assembly expert, making decisions on package design and contributing to assembly process engineering activities.
- Create and refine bonding diagrams and contribute to the evolution of Allegro's design rules.
- Lead bill of material selection, optimizing for performance, cost, and manufacturability.
- Develop, execute, and oversee comprehensive qualification planning and execution.
- Perform in-depth assembly data review and qualification data review, driving corrective actions and continuous improvement.
What you'll need
- Bachelor's degree (BS) in an engineering field such as Mechanical Engineering, Chemical Engineering, or Electrical Engineering.
- Minimum of three (3) to five (5) years of experience in semiconductor packaging and assembly engineering.
- Demonstrated expertise in semiconductor packaging and assembly processes.
- Strong understanding and practical application of project management principles.
- Proven proficiency in utilizing quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.
- Proficiency in Microsoft Excel and Microsoft PowerPoint.
Skills: packaging projects, assembly process, bonding diagrams, qualification planning, DFMEA
This role has been open 19 days — well below the 56-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
56 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Allegro MicroSystems | All employers we track in this specialty (297 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 25 | 9479 · 109 employers |
| Median days open | 19 d | 56 d (−37 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Skills observed across this category: packaging projects, assembly process, bonding diagrams, qualification planning, DFMEA
Who's hiring in this category
- KLA Corporation · 50 open roles · median 104 d
- Micron Technology · 36 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 43 d
- Renesas Electronics · 19 open roles · median 23 d
- onsemi · 15 open roles · median 14 d
- Lumilens · 13 open roles · median 47 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.