Lead Engineer, Package Development
Originally posted 31 August 2026 by the employer.
About the role
This role is for an experienced professional to take a leading role in bringing new products from design to production, responsible for defining test strategies, leading validation efforts, and driving yield improvement for complex products.
What you'll do
- Collaborate with cross-functional teams including Business Units, Device Design, Manufacturing, Quality, and Reliability.
- Create, maintain, and update documentation including standard operation procedures, process flows, workflows, bonding diagrams / drawings, and package outline drawings.
- Support the release and adoption of documentation.
- Document and report on internal procedures and regulatory body requirements.
What you'll need
- BS or MS in Electrical Engineering, Mechanical Engineering, or Materials Science with 5+ years of experience in semiconductor product design, development, and operations / manufacturing.
- Strong expertise in the use of AutoCAD.
- Familiarity with GD&T standards.
- Strong expertise in the use of 3D design software such as Autodesk Inventor, SolidWorks, Pro/Engineer (PTC Creo).
- Strong expertise in the use of Microsoft Word, Excel, Power Point, Project, Visio.
- Familiarity with project management and APQP processes.
- Familiarity with industry Qualification standards including JEDEC, AEC-Q100, ASME, IPC, IEC.
Nice to have
- Familiarity with package design rules.
- Familiarity with packaging materials including epoxies, molding compounds, wires, solders, and leadframe alloys.
- Knowledge of packaging assembly processes including wafer back-grinding, dicing, wafer bumping, die attach, flip chip, gold and copper wire bonding, transfer, and injection molding, MCM, surface mount, plating, and singulation.
Skills: package development, bonding diagrams, package outline drawings, packaging materials, packaging assembly processes
This role has been open 23 days — well below the 70-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
198
|
Median days open
70 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Allegro MicroSystems | All employers we track in this specialty (198 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 198 |
| Open roles in the wider Process, Fab & Equipment family | 25 | 9525 · 109 employers |
| Median days open | 47 d | 70 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: package development, bonding diagrams, package outline drawings, packaging materials, packaging assembly processes
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 35 d
- Renesas Electronics · 20 open roles · median 27 d
- Micron Technology · 18 open roles · median 146 d
- Monolithic Power Systems · 12 open roles · median 188 d
- Intel Corporation · 11 open roles · median 153 d
- onsemi · 8 open roles · median 51 d
How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.