Junior Failure Analysis Engineer - Bucheon-si, Gyeonggi-do, Korea, Republic of, South Korea
Originally posted 6 October 2026 by the employer.
About the role
This role involves hands-on technical problem-solving focusing on package and die level failure analysis of Logic, Mixed Signal, Power ICs, Discrete, Interface, RF Power, and Optoelectronic devices. Failure analysis will be performed on failures from wafer fabrication, package assembly, reliability stress tests, qualification fails, customer returns, and new product and process introduction fails.
What you'll do
- Conduct failure analysis on failures from wafer fabrication, package assembly, reliability stress tests, qualification fails, and customer returns.
- Perform electrical bench verification and characterization of failures.
- Utilize non-destructive analysis techniques such as X-ray, acoustic analysis, and package inspection.
- Apply circuit schematics, layouts, and fault isolation techniques to determine failing locations.
- Generate high-quality Product Analysis Reports for internal staff and customers.
- Identify and implement advanced methods of circuit failure analysis.
This role has been open 21 days — well below the 47-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
214
|
Median days open
47 d
|
Median salary
$97k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (214 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 214 |
| Open roles in the wider Process, Fab & Equipment family | 254 | 10125 · 107 employers |
| Median days open | 46 d | 47 d (−1 d vs this employer) |
| Median salary (USD postings) | — | $97k |
Who's hiring in this category
- Micron Technology · 45 open roles · median 53 d
- GlobalFoundries · 16 open roles · median 35 d
- Infineon Technologies · 15 open roles · median 29 d
- Lam Research · 15 open roles · median 34 d
- Western Digital · 12 open roles · median 41 d
- AMD · 9 open roles · median 95 d
How we counted: 214 open Failure Analysis Engineering (Failure Analysis) roles from 40 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.