Internship - Mechanical Engineer - USA - CA - San Jose (Ridder), United States
Originally posted 20 October 2026 by the employer.
About the role
Lumentum is seeking an intern to join the Module Package Engineering Team to support the structural development of Cloud Module products from chip and component level up to transceiver level. The role focuses on mechanical structure, thermal performance, and packaging design.
What you'll do
- Provide ideas for new chip, component, and Module design. - Build product prototypes. - Perform thermal stress analysis for new or existing package designs. - Perform GD&T analysis. - Participate in DFM activities.
What you'll need
- Currently enrolled in an undergraduate or graduate degree program in mechanical engineering or a related technical program. - Foundational knowledge of concepts, tools, or methods relevant to the internship. - Demonstrated ability to apply classroom learning through coursework, projects, laboratory work, research, or other relevant experience. - Availability for the full internship period.
Nice to have
- Knowledge of FEA software such as ANSYS. - Experience in opto-mechanical designs. - Experience with production development. - Abilities in mechanical design, drafting, and tolerance analysis, with familiarity using SolidWorks and Agile.
This role has been open 0 days — well below the 52-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
973
|
Median days open
52 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lumentum | All employers we track in this specialty (973 roles · 101 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 973 |
| Open roles in the wider Software, Firmware & Systems family | 28 | 6222 · 145 employers |
| Median days open | 15 d | 52 d (−37 d vs this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation · 76 open roles · median 36 d
- KLA Corporation · 65 open roles · median 46 d
- Teradyne · 56 open roles · median 32 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 50 open roles · median 68 d
- AMD · 46 open roles · median 50 d
How we counted: 973 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 20 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.