Internship - Materials Innovation - Singapore
Originally posted 23 September 2026 by the employer.
About the role
This internship focuses on advancing polymer materials for electronic packaging. The role involves exploring polymer solutions, simulating material properties, and contributing to formulation development for Encapsulating Material Compounds (EMC).
What you'll do
- Conduct literature review of specific domain of polymers used in electronic packaging.
- Plan & conduct Design of Experiments (DOE).
- Identify & investigate different influential factors in experiments setup.
- Perform materials characterization & evaluation.
- Explore AI application in material development.
- Make technical presentations to local & global teams.
What you'll need
- On track to attain a Bachelor's/Master's degree in Computer Science/Computer Engineering/Electrical & Electronic/Material Science/Chemical Engineering.
- Familiar with basic software skills, e.g., MATLAB and Python.
- Strong team player with effective communication skills.
- Able to work under minimum supervision and take initiative.
Skills: polymer solutions, electronic packaging, formulation development, encapsulating material compounds, material characterization
This role has been open 0 days — well below the 69-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
69 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 29 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 318 | 9479 · 109 employers |
| Median days open | 34 d | 69 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: polymer solutions, electronic packaging, formulation development, encapsulating material compounds, material characterization
Who's hiring in this category
- Infineon Technologies (this employer) · 28 open roles · median 34 d
- Renesas Electronics · 20 open roles · median 26 d
- Micron Technology · 17 open roles · median 145 d
- Intel Corporation · 12 open roles · median 151 d
- Monolithic Power Systems · 12 open roles · median 187 d
- onsemi · 8 open roles · median 50 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.