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Micron Technology

Intern - DRAM Technology DTCO & PPA Assessment Engineer

Micron Technology Boise, ID - Main Site, United States Full-time 2 months ago
Digital Design & SoC Architecture Memory & Storage Technologies

Originally posted 1 September 2026 by the employer.

About the role

What you'll do

  • Evaluate emerging DRAM technologies and analyze their impact on future product architectures and design tradeoffs.
  • Perform transistor-level simulations and circuit benchmarking using industry-standard EDA tools such as HSPICE and FineSim.
  • Develop and utilize Claude AI-based automation workflows and data analysis processes to improve simulation efficiency and engineering productivity.
  • Analyze technical data and communicate insights through presentations and reports that support technology development decisions.
  • Collaborate with device engineering, modeling, process integration, and circuit design teams on multi-functional projects.

What you'll need

  • Currently pursuing a M.S., or Ph.D. in Electrical Engineering, Computer Engineering, or a related technical field.
  • Expected graduation date of Fall 2025 or later.
  • Demonstrated knowledge of VLSI design, semiconductor device physics, and CMOS fundamentals.
  • Experience with AI-enabled tools, including Claude AI Agents, and data analysis methodologies.
  • Familiarity with circuit simulation tools such as HSPICE, FineSim, or equivalent EDA platforms.

Nice to have

  • Coursework in CMOS modeling, advanced semiconductor devices, digital circuit design, or semiconductor process technology.
  • Experience with scripting languages and automation tools used for engineering workflows.
  • Experience applying AI, Agentic AI, or AI-assisted solutions to improve data analysis, simulation, or engineering productivity.
  • Exposure to machine learning-based data analysis techniques.
  • Experience presenting technical findings and collaborating in multi-functional engineering environments.

Skills: DRAM technologies, transistor-level simulations, HSPICE, FineSim, VLSI design, semiconductor device physics

More semiconductor jobs: Micron Technology jobs

Market context

This role has been open 65 days — below the 72-day median for Memory Design roles.

Memory Design · Memory Design

Open roles in category
302
Median days open
72 d
Category median salary (all employers)
$205k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Memory Design hiring
Metric Micron Technology All employers we track in this specialty (302 roles · 29 employers)
Open roles in this specialty 154 302
Median days open 81 d 72 d (+9 d vs this employer)
Median salary (USD postings) — $205k

Skills observed across this category: DRAM technologies, transistor-level simulations, HSPICE, FineSim, VLSI design, semiconductor device physics

Who's hiring in this category

  • Micron Technology (this employer) · 154 open roles · median 82 d
  • Synopsys · 30 open roles · median 77 d
  • Qualcomm · 18 open roles · median 106 d
  • Broadcom · 16 open roles · median 78 d
  • SanDisk · 15 open roles · median 7 d
  • NVIDIA · 8 open roles · median 59 d

How we counted: 302 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.

Apply now
Boise, ID - Main Site, United States
On-site
Full-time
2 months ago

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