Intern Design Engineer - HIG HBM
Work on High Bandwidth Memory (HBM) memory solutions.
Originally posted 23 September 2026 by the employer.
About the role
As an HBM Design Engineer Intern, you will gain hands-on experience in semiconductor design, simulation, verification, and analysis.
What you'll do
- Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits.
- Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities.
- Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity.
- Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews and debug activities.
- Document technical work, experimental results, AI-Enabled insights, and design methodologies.
What you'll need
- Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
- Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects.
- Demonstrated understanding of combinational and sequential logic design concepts.
- Experience with Verilog, SystemVerilog, or VHDL through academic, research, or project work.
- Programming experience in Python, Perl, Tcl, C/C++, or similar languages.
Nice to have
- Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
- Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage concepts.
- Familiarity with Linux/Unix environments, scripting, and automation techniques.
- Exposure to semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar platforms.
- Previous academic, research, or internship experience related to VLSI, ASIC, FPGA, semiconductor design, or applying AI to engineering workflows and analysis.
Skills: HBM memory, RTL development, circuit implementation, timing analysis, functional validation
More semiconductor jobs: Micron Technology jobs · Richardson jobs
This role has been open 43 days — well below the 72-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
302
|
Median days open
72 d
|
Category median salary (all employers)
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (302 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 154 | 302 |
| Median days open | 81 d | 72 d (+9 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM memory, RTL development, circuit implementation, timing analysis, functional validation
Who's hiring in this category
- Micron Technology (this employer) · 154 open roles · median 82 d
- Synopsys · 30 open roles · median 77 d
- Qualcomm · 18 open roles · median 106 d
- Broadcom · 16 open roles · median 78 d
- SanDisk · 15 open roles · median 7 d
- NVIDIA · 8 open roles · median 59 d
How we counted: 302 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.