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Micron Technology

Intern - AI Hardware and Memory Systems - Folsom, CA, United States

Micron Technology Folsom, CA, United States Full-time 20 days ago
AI/ML Hardware

$104,499 - $104,499 USD yearly

Originally posted 15 September 2026 by the employer — open 3 days.

About the role

This role involves researching and prototyping advanced memory and system architecture concepts for AI accelerators.

What you'll do

  • Research and evaluate advanced memory and system architecture concepts for AI accelerators.
  • Develop and analyze performance models to assess bandwidth, latency, power, scalability, and overall system efficiency.
  • Analyze AI training, inference, and HPC workloads to identify memory and system performance bottlenecks.
  • Investigate memory hierarchy, HBM, DRAM, cache, storage, and interconnect optimizations to improve system performance.
  • Collaborate with cross-functional engineering teams and explore AI/LLM-based tools to enhance architecture research and development workflows.

What you'll need

  • Currently pursuing a PhD in Computer Architecture, Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • 0-2 years of relevant experience in computer architecture, memory systems, or AI hardware.
  • Knowledge of memory system architecture, including caches, HBM, DRAM, memory hierarchy, and interconnect concepts.
  • Experience with performance modeling, architectural simulation, system analysis, or related research methodologies.
  • Programming experience in Python, C++ or similar programming languages.

Nice to have

  • Research experience in AI accelerators, GPU architecture, memory systems, interconnects, or high-performance computing.
  • Experience with AI/ML frameworks such as PyTorch, TensorFlow, or CUDA-based development environments.
  • Familiarity with architectural simulators, SystemC, GPU profiling tools, emulation platforms, or performance analysis tools.
  • Knowledge of rack-scale systems, scale-up/scale-out architectures, and advanced interconnect technologies.
  • Publications, conference papers, or demonstrated research contributions in computer architecture, AI hardware, memory systems, or related fields.

Skills: AI accelerators, memory systems, performance models, HBM, interconnects

Market context

This role has been open 3 days — well below the 65-day median for AI/ML Hardware Engineering roles.

AI/ML Hardware Engineering · AI ML Hardware

Open roles in category
518
Median days open
65 d
Median salary
$229k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in AI/ML Hardware Engineering hiring
Metric Micron Technology All employers we track in this specialty (518 roles · 76 employers)
Open roles in this specialty 32 518
Open roles in the wider Software, Firmware & Systems family 258 5796 · 143 employers
Median days open 37 d 65 d (−28 d vs this employer)
Median salary (USD postings) — $229k

Skills observed across this category: AI accelerators, memory systems, performance models, HBM, interconnects

Who's hiring in this category

  • Qualcomm · 106 open roles · median 97 d
  • NVIDIA · 85 open roles · median 65 d
  • AMD · 43 open roles · median 60 d
  • Micron Technology (this employer) · 32 open roles · median 37 d
  • Mobileye · 25 open roles · median 51 d
  • Analog Devices · 14 open roles · median 22 d

How we counted: 518 open AI/ML Hardware Engineering (AI ML Hardware) roles from 76 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
Folsom, CA, United States
On-site
Full-time
$104,499 - $104,499 USD yearly
20 days ago

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