Integrated Circuit - Packaging Architect Engineer - TX, Austin, United States
Packaging & Advanced Integration
Originally posted 6 August 2026 by the employer.
About the role
This role involves leading advanced packaging technology across client, server, gaming, and GPU products, defining packaging architecture and roadmaps with product design teams.
What you'll do
- Work with product architects to define package architectures and roadmaps.
- Lead new package technology development initiatives from concept to qualification.
- Drive test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines.
- Establish yield roadmap and implement yield and data analytic tools.
- Lead cross-functional teams in designing and developing package architectures and processes.
- Communicate technology development progress and solve technical problems related to yield, reliability, and process development.
What you'll need
- Proven track record of driving technology development in semiconductor field.
- Leadership experience driving engineering teams in architecture definition, process definition, or yield improvement.
- Excellent oral and written communication skills.
- BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, or Electrical Engineering or equivalent.
Nice to have
- Experience in a semiconductor technology development role.
- Experience working with manufacturing partners such as suppliers, OSATs, and foundry partners.
- In-depth knowledge in material science, thin film process development, or packaging.
- Experience in a leadership role driving cross-functional teams.
- Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment.
Market context
This role has been open 73 days — well below the 117-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Chiplet Interconnect
|
Open roles in category
41
|
Median days open
117 d
|
Median salary
$219k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (41 roles · 19 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 41 |
| Median days open | 73 d | 117 d (−44 d vs this employer) |
| Median salary (USD postings) | — | $219k |
Who's hiring in this category
- Qualcomm · 5 open roles · median 110 d
- Intel Corporation · 4 open roles · median 34 d
- Marvell Technology · 4 open roles · median 101 d
- Micron Technology · 4 open roles · median 157 d
- NVIDIA · 4 open roles · median 69 d
- GlobalFoundries · 3 open roles · median 37 d
How we counted: 41 open Chiplet/Advanced Packaging Design (Chiplet Interconnect) roles from 19 employers tracked in the SemiconductorJobs index, counted 18 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.