IC Package Development Engineer - Hyderabad - Phoenix Aquila, India
Originally posted 28 August 2026 by the employer.
About the role
This role involves supporting the development and engineering of IC packages, from feasibility studies to manufacturing readiness. The position focuses on leveraging AI/ML models and automation for design validation, optimization, and simulation acceleration in semiconductor package technologies.
What you'll do
- Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments.
- Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.
- Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables.
- Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities.
- Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities.
- Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration.
What you'll need
- Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.
- Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
- Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.
- Programming or scripting exposure in Python, MATLAB, C/C++.
- Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.
Nice to have
- Semiconductor packaging exposure
- Simulation exposure
- Experience working on AI/ML solutions
- Strong generative AI usage
- Data analytics and visualization
- PLM/ALM exposure, including Teamcenter, change management, and master data
Skills: AI/ML models, design validation, process optimization, automation, Python, data analytics
This role has been open 26 days — well below the 68-day median for AI/ML Hardware Engineering roles.
AI/ML Hardware Engineering · AI ML Hardware
|
Open roles in category
514
|
Median days open
68 d
|
Median salary
$232k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (514 roles · 75 employers) |
|---|---|---|
| Open roles in this specialty | 32 | 514 |
| Open roles in the wider Software, Firmware & Systems family | 268 | 5948 · 143 employers |
| Median days open | 41 d | 68 d (−27 d vs this employer) |
| Median salary (USD postings) | — | $232k |
Skills observed across this category: AI/ML models, design validation, process optimization, automation, Python, data analytics
Who's hiring in this category
- Qualcomm · 106 open roles · median 101 d
- NVIDIA · 84 open roles · median 63 d
- AMD · 46 open roles · median 61 d
- Micron Technology (this employer) · 33 open roles · median 43 d
- Mobileye · 21 open roles · median 57 d
- Analog Devices · 14 open roles · median 26 d
How we counted: 514 open AI/ML Hardware Engineering (AI ML Hardware) roles from 75 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.