IC Package Development Engineer
Originally posted 28 August 2026 by the employer.
About the role
This role involves supporting package feasibility studies, architecture evaluations, and design optimization for memory and semiconductor package technologies. You will also contribute to AI/ML model development for design validation, optimization, and simulation acceleration.
What you'll do
- Support package feasibility studies, architecture evaluations, and technical risk assessments.
- Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.
- Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, and design inputs.
- Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, and documentation.
- Develop automation for repetitive design, simulation, data-processing, validation, and engineering workflow activities.
- Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration.
What you'll need
- Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.
- Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
- Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.
- Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.
Nice to have
- Semiconductor packaging exposure
- Simulation exposure
- Experience working on AI/ML solutions
- Strong generative AI usage
- Data analytics and visualization
- PLM/ALM exposure, including Teamcenter, change management, and master data
Skills: AI/ML models, design validation, process optimization, automation, Python, data analytics
More semiconductor jobs: Micron Technology jobs · AI chip design jobs · India jobs
This role has been open 69 days — well below the 101-day median for AI/ML Hardware Engineering roles.
AI/ML Hardware Engineering · AI ML Hardware
|
Open roles in category
477
|
Median days open
101 d
|
Category median salary (all employers)
$238k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (477 roles · 76 employers) |
|---|---|---|
| Open roles in this specialty | 16 | 477 |
| Open roles in the wider Software, Firmware & Systems family | 233 | 6473 · 156 employers |
| Median days open | 66 d | 101 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $238k |
Skills observed across this category: AI/ML models, design validation, process optimization, automation, Python, data analytics
Who's hiring in this category
- NVIDIA · 103 open roles · median 79 d
- Qualcomm · 96 open roles · median 127 d
- AMD · 29 open roles · median 119 d
- Micron Technology (this employer) · 16 open roles · median 66 d
- Mobileye · 15 open roles · median 93 d
- Analog Devices · 14 open roles · median 54 d
How we counted: 477 open AI/ML Hardware Engineering (AI ML Hardware) roles from 76 employers tracked in the SemiconductorJobs index, counted 5 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.