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NXP Semiconductors

HW/SW System and Application Engineer Intern-Summer 2027

NXP Semiconductors Chandler (Office), United States Internship 1 day ago
Digital Design & SoC Architecture

Work on High Frequency Modem wireless interface evaluation and demonstration platforms.

Originally posted 2 November 2026 by the employer.

About the role

This role involves developing embedded firmware and FPGA logic for High Frequency Modem wireless interface evaluation and demonstration platforms. You will support hardware bring-up, create automated test tools, and perform system-level validation.

What you'll do

  • Develop embedded firmware and FPGA logic for High Frequency Modem wireless interface evaluation and demonstration platforms.
  • Develop Python tools for automated test, data collection, and analysis.
  • Interface directly with evaluation hardware and laboratory equipment.
  • Develop test cases to exercise wireless data-link operation under varied conditions.
  • Support hardware bring-up, debugging, and system-level validation while identifying performance limitations.
  • Document the test environment, validation results, and engineering recommendations.

What you'll need

  • Currently pursuing a B.S. or M.S. in Computer Systems Engineering, Electrical Engineering, Computer Engineering, or a related field.
  • Must be returning to school or graduating at the conclusion of the internship term (graduating July 2027 or later).
  • Experience with C/C++ and Python.
  • Familiarity with embedded platforms.
  • Experience with digital hardware design and testbench/simulation environments.
  • Familiarity with Git and Linux.

Nice to have

  • Experience with Verilog/SystemVerilog and FPGA development.
  • Exposure to PCB design and laboratory hardware debugging.

Skills: C/C++, Python, Verilog, FPGA, PCB, Embedded

More semiconductor jobs: NXP Semiconductors jobs · Hardware design jobs

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Chandler (Office), United States
On-site
Internship
1 day ago

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