HPC Systems Manager - Singapore
Originally posted 13 September 2026 by the employer — open 7 days.
About the role
This role involves leading and managing engineering teams to shape AI-driven solutions, specializing in AI Systems and High-Performance Computing (HPC) within the HPC domain.
What you'll do
- Lead a team of engineers and system architects to develop the platform for DL training and inference.
- Define the technical vision, strategy, and roadmap for DL/AI systems within the HPC domain.
- Collaborate with hardware and software teams to design and optimize AI infrastructure.
- Oversee the management of GPU-based clusters.
- Drive performance improvements by analyzing bottlenecks and optimizing system components.
- Benchmark AI models and algorithms on HPC clusters.
What you'll need
- Proven track record in managing engineering teams in AI, HPC, or related fields.
- Familiarity with AI frameworks (TensorFlow, PyTorch) and HPC tools (Slurm, OpenMPI).
- Strong understanding of GPU architectures, CUDA programming, and parallel computing.
- Knowledge of containerization (Docker, Kubernetes) and cloud-based AI deployments.
- Ability to mentor and develop team members.
- Experience presenting technical concepts to executive leadership.
This role has been open 7 days — well below the 54-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
54 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 49 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 402 | 9314 · 108 employers |
| Median days open | 101 d | 54 d (+47 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation (this employer) · 49 open roles · median 101 d
- Micron Technology · 36 open roles · median 28 d
- Renesas Electronics · 21 open roles · median 20 d
- Infineon Technologies · 18 open roles · median 40 d
- Intel Corporation · 13 open roles · median 75 d
- Lumilens · 13 open roles · median 44 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.