HPC Product Development Engineer - Singapore
Packaging & Advanced Integration
Originally posted 13 September 2026 by the employer — open 7 days.
About the role
This role involves the design, development, and maintenance of customized Windows OS images and deployment solutions for KLA platforms.
What you'll do
- Design, develop, and maintain customized Windows OS images and deployment solutions.
- Develop and support PowerShell-based automation, diagnostics, and system management tools.
- Drive validation, testing, and root cause analysis activities.
- Collaborate with hardware, software, manufacturing, and system integration teams to resolve complex system-level issues.
- Author technical documentation, participate in architecture and design reviews, and contribute to engineering best practices.
What you'll need
- Strong understanding of computer architecture, hardware subsystems, operating systems, networking, and system-level performance characteristics.
- Proficiency in PowerShell and at least one additional scripting or programming language such as Python or Bash.
- Experience with Windows OS deployment, customization, troubleshooting, automation, and hardware/software integration.
- Demonstrated ability to independently solve complex technical problems and communicate effectively across teams.
- Bachelor's Level Degree and related work experience of 5 years; or Master's Level Degree and related work experience of 3 years; or Doctorate (Academic) Degree and 0 years related work experience.
Market context
This role has been open 7 days — well below the 54-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
54 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 49 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 402 | 9314 · 108 employers |
| Median days open | 101 d | 54 d (+47 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation (this employer) · 49 open roles · median 101 d
- Micron Technology · 36 open roles · median 28 d
- Renesas Electronics · 21 open roles · median 20 d
- Infineon Technologies · 18 open roles · median 40 d
- Intel Corporation · 13 open roles · median 75 d
- Lumilens · 13 open roles · median 44 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.