HBM PROCESS ENGINEER(FY28 NCG) - Taichung - MTB, Taiwan
Originally posted 15 September 2026 by the employer — open 3 days.
About the role
This role involves process engineering for HBM (High Bandwidth Memory) manufacturing, focusing on leveraging AI and data analytics to optimize backend processes.
What you'll do
- Identify process variation and uncover KPIVs using AI and advanced analytics tools.
- Develop and deploy AI-assisted monitoring, anomaly detection, and predictive models to improve process stability, yield, and equipment performance.
- Automate routine engineering analysis, reporting, and decision-making workflows using digital solutions.
- Drive data-driven process optimization through machine learning, pattern recognition, and large-scale manufacturing data analysis.
- Implement smart manufacturing solutions and AI-enabled process control methodologies.
- Establish and maintain digital twins, predictive maintenance models, and AI-based early warning systems.
What you'll need
- Master's degree or above in Engineering, Science, or a related technical field.
- Around 2 years of experience in the semiconductor industry.
- Knowledge and practical experience in Lamination, Lapping/Grinding, and Laser Dicing processes.
- Strong problem-solving, process improvement, and cross-functional collaboration skills.
Nice to have
- Hands-on experience in semiconductor assembly or backend processes.
Skills: HBM, semiconductor assembly, backend processes, lamination, lapping/grinding, laser dicing
This role has been open 3 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 1449 | 9358 · 108 employers |
| Median days open | 27 d | 53 d (−26 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: HBM, semiconductor assembly, backend processes, lamination, lapping/grinding, laser dicing
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology (this employer) · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.