HBM Architect
$150,000 - $320,000 USD yearly
Design DRAM and HBM architecture with Full Custom + Digital Co-Design and PDN analysis across Wafer and KGSD stages.
Originally posted 28 July 2026 by the employer.
About the role
As an HBM Architect at SK Hynix America, you will architect and design circuits for DRAM and HBM products to meet internal and external specifications. This role covers product development through characteristic analysis across Wafer, KGSD (Known Good Stack Die), and Assembly stages.
What you'll do
- Design circuits for DRAM and HBM products that satisfy internal and external performance specifications.
- Improve design quality and silicon yield throughout the DRAM and HBM product development cycle.
- Perform characteristic analysis and verify specifications at the Wafer, KGSD (Known Good Stack Die), and Assembly stages.
- Enhance performance and ensure stable device operation to fulfill customer requirements during product development.
What you'll need
- Bachelor’s degree or higher in Electrical Engineering or a related discipline.
- 3+ years of relevant industry experience (including recognized research periods during Master’s or Ph.D. programs).
- Experience reviewing and designing DRAM or HBM Architecture with a solid understanding of DRAM/HBM subsystems.
- Experience in Full Custom + Digital Co-Design and PDN (Power Delivery Network) analysis.
- Experience in Full Custom-based Logic Foundry design.
- Hands-on experience with tools and equipment used for DRAM or HBM product failure analysis.
Nice to have
- Master's degree in Electrical Engineering or a related discipline.
- Extensive experience in product development and analysis related to DRAM or HBM design.
- Experience in HBM product assembly system analysis.
- Experience in Full Custom Design environments with advanced process nodes (DRAM 1x nm, Foundry 3nm or below).
- Proficiency with Python, Spotfire, Verilog, and circuit simulators such as Hspice, Csim, PrimeSim, or Spectre.
Skills: HBM architecture, 3D-stacked DRAM, DRAM subsystems, Full Custom + Digital Co-Design, PDN analysis, circuit simulators
More semiconductor jobs: San Jose jobs
This role has been open 97 days — well above the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
311
|
Median days open
69 d
|
Category median salary (all employers)
$200k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SK Hynix America | All employers we track in this specialty (311 roles · 30 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 311 |
| Median days open | 97 d | 69 d (+28 d vs this employer) |
| Median salary (USD postings) | — | $200k |
Skills observed across this category: HBM architecture, 3D-stacked DRAM, DRAM subsystems, Full Custom + Digital Co-Design, PDN analysis, circuit simulators
Who's hiring in this category
- Micron Technology · 160 open roles · median 79 d
- Synopsys · 32 open roles · median 74 d
- Qualcomm · 19 open roles · median 95 d
- Broadcom · 16 open roles · median 75 d
- SanDisk · 15 open roles · median 4 d
- NVIDIA · 8 open roles · median 56 d
How we counted: 311 open Memory Design (Memory Design) roles from 30 employers tracked in the SemiconductorJobs index, counted 3 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.