Global OSAT Operation Engineering - Singapore
Originally posted 15 September 2026 by the employer — open 3 days.
About the role
This role provides technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites. You will drive manufacturing excellence initiatives and lead qualification and implementation of subcontractor changes, with a focus on advanced packaging technologies like WLCSP, FOWLP, Cu Pillar Bumping, and Flip-Chip.
What you'll do
- Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites.
- Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
- Review and approve subcontractor 8D, CQC, Safe Launch reports, PCN submissions, and corrective/preventive action plans.
- Lead OSAT site transfer, second-source qualification, and capacity expansion projects.
- Own qualification planning, gap assessment, risk mitigation, Safe Launch execution, and PCN activities.
- Lead onsite root cause investigations and resolution of major quality incidents, yield excursions, customer issues, and severe incident escalations.
What you'll need
- Degree or MSc Degree in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent.
- Minimum 8-10 years of semiconductor assembly and packaging experience.
- Technical knowledge in advanced packaging technologies such as WLCSP, FOWLP, Cu Pillar Bumping, and Flip-Chip.
- Experience in package qualification, Safe Launch execution, change management (PCN), and subcontractor management.
- Knowledge of DOE, SPC, FDC, process control methodologies, reliability qualification, and root cause analysis techniques.
- Proven experience in yield improvement, quality management, and manufacturing productivity enhancement.
Skills: OSAT operation, semiconductor assembly, packaging experience, advanced packaging technologies, package qualification, yield improvement
This role has been open 3 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NXP Semiconductors | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 120 | 9358 · 108 employers |
| Median days open | 24 d | 53 d (−29 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: OSAT operation, semiconductor assembly, packaging experience, advanced packaging technologies, package qualification, yield improvement
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.