Field Applications Engineer (FAE) Intern - Summer 2027 - United States
Originally posted 6 October 2026 by the employer.
About the role
This Field Applications Engineer (FAE) Intern role involves partnering with customers to integrate NXP semiconductor technologies into their systems. Interns will gain hands-on experience with embedded systems, lab validation, and design-in activity.
What you'll do
- Support customer meetings, product evaluations, and solution demonstrations for NXP MCUs, MPUs, connectivity, analog, power-management, and edge-processing solutions.
- Analyze customer issues, reproduce problems, and contribute to technical action plans.
- Bring up evaluation boards, configure SDKs, and integrate example software into application prototypes.
- Develop or modify firmware and application code in C, C++, Python, or similar languages.
- Perform product evaluation, lab validation, and system-level troubleshooting using lab equipment.
- Prepare customer-ready technical presentations, demonstrations, application notes, and training material.
What you'll need
- Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
- Rising junior, senior, or graduate student — expected graduation between December 2027 and June 2029.
- Cumulative GPA of 3.0/4.0 or higher.
- Authorization to work in the United States.
- Availability for 12 weeks full-time during Summer 2027 (May–August).
Nice to have
- Coursework or project experience in embedded systems, analog and digital circuits, computer architecture, microcontrollers/processors, wireless communications, power electronics, control systems, or semiconductor applications.
- Hands-on experience with microcontrollers, MPUs, FPGAs, development boards, evaluation kits, or reference designs; familiarity with ARM-based systems.
- Programming experience in C, C++, Python, or similar languages, with exposure to IDEs, SDKs, version control, RTOS basics, or embedded Linux.
- Familiarity with common embedded interfaces such as UART, SPI, I2C, CAN, USB, or Ethernet.
- Experience using or willingness to learn common lab equipment, schematic/PCB review, board bring-up, firmware debugging, sensor integration, motor control, edge AI, or robotics applications.
Skills: customer application support, design-in, embedded development, lab validation, technical presentations
This role has been open 9 days — well below the 93-day median for Applications FAE roles.
Applications FAE · Mixed Signal
|
Open roles in category
54
|
Median days open
93 d
|
Median salary
$136k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NXP Semiconductors | All employers we track in this specialty (54 roles · 16 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 54 |
| Median days open | 9 d | 93 d (−84 d vs this employer) |
| Median salary (USD postings) | — | $136k |
Skills observed across this category: customer application support, design-in, embedded development, lab validation, technical presentations
Who's hiring in this category
- Analog Devices · 10 open roles · median 34 d
- Texas Instruments · 9 open roles · median 43 d
- Microchip Technology · 6 open roles · median 115 d
- Arrow Electronics · 5 open roles · median 100 d
- Infineon Technologies · 4 open roles · median 128 d
- Omni Design Technologies · 4 open roles · median 121 d
How we counted: 54 open Applications FAE (Mixed Signal) roles from 16 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.