$126,800 - $202,800 USD yearly
Originally posted 29 July 2026 by the employer. Relisted by the employer on 17 September 2026.
About the role
The Field Application Engineer works collaboratively and independently to determine and develop practical application solutions for semiconductor devices on Teradyne automated test equipment (ATE) platforms.
What you'll do
- Develop, debug, and deploy test solutions for Digital, High-Speed Digital, System on Chip, Mixed Signal, and Analog semiconductor devices. - Develop test program software and conduct load board and probe card schematics design and layout reviews. - Analyze problems and recommend solutions on Teradyne ATE platforms to optimize customer throughput and test coverage. - Release test solutions to production involving production handler and prober equipment, including correlation and gauge R&R. - Capture customer requirements for hardware, software, test cell integration, electrical and mechanical schematics, and interface PCB design. - Demonstrate tester capabilities for customer evaluations, deliver technical training, and assist customers on tester operation.
What you'll need
- Bachelor's or higher degree in Electrical Engineering, Computer Engineering, or a related field. - 5 to 8 years of semiconductor testing industry experience with hands-on IC component testing project development. - Test or product engineering experience in Digital, High-Speed Digital, High-Power Computing, System on Chip, Mixed Signal, or Analog testing and test development on ATE platforms. - Knowledge of Visual Basic, C, C++, Java, or C#.NET programming. - Ability to travel 25% or more, both domestic and international, with required auto liability or minimum insurance.
Nice to have
- Development experience on Teradyne or other semiconductor ATE platforms, such as Teradyne UltraFlex, UltraFlexPlus, IG-XL, Eagle Test Systems, EV, EV-MST, Advantest V93K, SmarTest 7, or SmarTest 8. - Knowledge of handler and prober interface experience. - General understanding of ATE industry trends, competitive products, and product positioning. - Supervisory experience in leading teams locally and globally with past experience in employee management.
Skills: Field Application Engineer, test solutions, Digital, High-Speed Digital, System on Chip
This role has been open 203 days — well above the 72-day median for Applications FAE roles.
Applications FAE · Manufacturing Equipment
|
Open roles in category
196
|
Median days open
72 d
|
Median salary
$148k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Teradyne | All employers we track in this specialty (196 roles · 17 employers) |
|---|---|---|
| Open roles in this specialty | 62 | 196 |
| Median days open | 34 d | 72 d (−38 d vs this employer) |
| Median salary (USD postings) | — | $148k |
Skills observed across this category: Field Application Engineer, test solutions, Digital, High-Speed Digital, System on Chip
Who's hiring in this category
- Teradyne (this employer) · 62 open roles · median 33 d
- KLA Corporation · 41 open roles · median 125 d
- Applied Materials · 34 open roles · median 68 d
- Keysight Technologies · 15 open roles · median 75 d
- ASML · 8 open roles · median 116 d
- Veeco Instruments · 7 open roles · median 82 d
How we counted: 196 open Applications FAE (Manufacturing Equipment) roles from 17 employers tracked in the SemiconductorJobs index, counted 25 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.