Originally posted 22 September 2026 by the employer.
About the role
This role involves joining the Automotive Field Applications team with a primary focus on automotive embedded software and customer-facing engineering tasks, specifically for ADI products. The engineer will be involved in system bring-up, software integration, and debugging.
What you'll do
- Support automotive embedded software development, integration, testing, and debugging.
- Independently handle customer platform bring-up, firmware and driver integration, software configuration, product evaluation, issue reproduction, and root-cause analysis.
- Develop and maintain embedded software demos, test programs, automation scripts, technical notes, and validation reports.
- Lead technical discussions, demonstrations, workshops, customer visits, and on-site troubleshooting.
- Work closely with Sales, Business Units, and engineering teams to track technical questions.
- Maintain and apply strong technical knowledge of automotive embedded software, MCU/DSP/SoC platforms, RTOS/Linux, automotive audio, networking, and ADI products.
What you'll need
- Master’s degree in Automotive Engineering, Vehicle Engineering, Electrical Engineering, Electronic Engineering, Computer Engineering, Automation, Computer Science, or a related discipline.
- At least three years of relevant industry experience in automotive embedded software, automotive electronics, semiconductor applications, or a related field.
- Good foundation in embedded software and proficiency in C/C++; knowledge of MCU, DSP, or SoC architecture, RTOS or embedded Linux, firmware, device drivers, debugging, or board bring-up.
- Proven hands-on capability in embedded software development, customer support, and system-level debugging, with the ability to independently analyze and resolve technical issues.
- Ability to explain technical observations clearly in Chinese and communicate in written and spoken English.
- Willingness to travel within China when needed.
Nice to have
- Knowledge or project experience in automotive audio, DSP, Ethernet, Automotive Ethernet, TSN/AVB, CAN, SPI, I2C, UART, I2S, or TDM.
Skills: field applications team, embedded software, customer support, firmware and driver integration, system bring-up
More semiconductor jobs: Analog Devices jobs · Field applications engineer jobs · China jobs
This role has been open 44 days — well below the 95-day median for Applications FAE roles.
Applications FAE · Automotive IC
|
Open roles in category
143
|
Median days open
95 d
|
Category median salary (all employers)
$152k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Analog Devices | All employers we track in this specialty (143 roles · 23 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 143 |
| Median days open | 38 d | 95 d (−57 d vs this employer) |
| Median salary (USD postings) | — | $152k |
Skills observed across this category: field applications team, embedded software, customer support, firmware and driver integration, system bring-up
Who's hiring in this category
- Infineon Technologies · 34 open roles · median 78 d
- Texas Instruments · 23 open roles · median 141 d
- NXP Semiconductors · 22 open roles · median 91 d
- Qualcomm · 10 open roles · median 35 d
- Renesas Electronics · 10 open roles · median 103 d
- Microchip Technology · 8 open roles · median 229 d
How we counted: 143 open Applications FAE (Automotive IC) roles from 23 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.