External Manufacturing NPI Engineer (Assembly Packaging) - Petaling, Selangor, Malaysia
Process & Device Engineering
Originally posted 24 September 2026 by the employer.
About the role
This role involves driving new product introduction (NPI) within external manufacturing, focusing on wafer-level packaging (WLP) and post-fab solutions.
What you'll do
- Own backend external manufacturing NPI from conceptualization, development, qualification to production launch.
- Drive DFM, technology & manufacturability readiness for new product/package development.
- Partner with OSATs to deliver assembly readiness for new product qualification.
- Manage production ramp, lead production safe launch, and provide technical support to resolve ramp issues.
- Collaborate with internal & external partners for technology pathfinding, package roadmap, and design rules/guideline development.
- Co-work with operations to drive continuous yield improvement for evolving challenges.
What you'll need
- Bachelor's Degree in Engineering/Materials Science or equivalent technical background.
- More than 10 years of experience in backend semiconductor IC manufacturing with assembly process expertise and shop floor experience.
- Hands-on experience in wafer-level packaging (WLP), bumping, and post-fab solutions.
- Familiarity with plating chemistry/process and material/metallurgy characterization & microstructural analysis.
- Prior experience in NPI, product/process integration, and familiar with Chip-to-Package Interaction (CPI) effect.
- Strong project management skills and multi-stakeholder management.
Market context
This role has been open 0 days — well below the 60-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
68
|
Median days open
60 d
|
Median salary
$175k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (68 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 68 |
| Open roles in the wider Process, Fab & Equipment family | 281 | 9490 · 109 employers |
| Median days open | 71 d | 60 d (+11 d vs this employer) |
| Median salary (USD postings) | — | $175k |
Who's hiring in this category
- Micron Technology · 13 open roles · median 107 d
- GlobalFoundries · 10 open roles · median 93 d
- Intel Corporation · 9 open roles · median 22 d
- Applied Materials · 8 open roles · median 30 d
- Renesas Electronics · 6 open roles · median 39 d
- Lumilens · 4 open roles · median 48 d
How we counted: 68 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.