Entry Level Talent for LPS (Master) - Leshan, Sichuan, China
Originally posted 20 August 2026 by the employer.
About the role
This role involves developing and maintaining product/process for existing packages and providing design risk assessments and mitigation plans.
What you'll do
- Develop product/process to meet established requirements.
- Perform integrity analysis of packaging using appropriate tools.
- Provide technical support to cross-functional teams to achieve project goals.
- Provide design risk assessments and mitigation plans.
- Provide optimal design options considering process/platform, BOM (lead frame design, epoxy, wire, compound), and cost.
- Develop package roadmaps based on product marketing requirements and technical strategy.
- Maintain design-related documents such as DFMEA, Design rule, and new product development procedures.
- Prepare design-related drawings for lead frames and tooling.
- Prepare BOM-related documents.
What you'll need
- Master's degree or above in Mechatronic Engineering, Semiconductor Engineering, or a related field.
- Proficiency in English with strong verbal and written communication skills, capable of conducting professional discussions in an international working environment.
Skills: product/process development, packaging, BOM, lead frame design, package roadmaps
This role has been open 38 days — well below the 73-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
203
|
Median days open
73 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (203 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 203 |
| Open roles in the wider Process, Fab & Equipment family | 285 | 9494 · 108 employers |
| Median days open | 18 d | 73 d (−55 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: product/process development, packaging, BOM, lead frame design, package roadmaps
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 39 d
- Renesas Electronics · 23 open roles · median 31 d
- Micron Technology · 18 open roles · median 150 d
- Intel Corporation · 12 open roles · median 156 d
- Monolithic Power Systems · 12 open roles · median 192 d
- onsemi (this employer) · 10 open roles · median 28 d
How we counted: 203 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.