ENGR STAFF, R&D ENGINEERING; PKG&ASSY - Seremban, Negeri Sembilan, Malaysia
Originally posted 24 September 2026 by the employer.
About the role
This Staff NPI Assembly Engineer leads New Product Introduction (NPI) activities for semiconductor assembly processes from development to high-volume manufacturing. This role is the technical owner for assembly process qualification, optimization, risk assessment, and production readiness, ensuring new products meet quality, cost, reliability, and manufacturing requirements.
What you'll do
- Define assembly manufacturing flow, process parameters, and control plans.
- Lead process characterization studies and DOE (Design of Experiments).
- Provide technical leadership for assembly operations including Die Attach, Wire Bond, Wafer Saw, Molding, Trim & Form, Singulation, Marking, and Packing.
- Lead failure analysis and root cause investigations for NPI-related issues.
- Create and maintain Process Flow, FMEA, Control Plan, Work Instructions, Qualification Reports, and Engineering Specifications.
- Drive yield enhancement and cost reduction initiatives using statistical analysis and SPC methodologies.
What you'll need
- Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Engineering, or Semiconductor-related disciplines.
- 5-8 years of experience in semiconductor assembly manufacturing or NPI engineering.
- Experience leading new product introductions and product transfers.
- Strong knowledge of semiconductor assembly processes.
- Understanding of Statistical Process Control (SPC), Design of Experiments (DOE), FMEA, MSA, 8D Problem Solving, Root Cause Analysis, Reliability Testing, and Process Qualification Methodologies.
- Data analysis using Minitab, JMP, Excel, or equivalent tools.
Skills: assembly manufacturing flow, process characterization, DOE, Die Attach, Wire Bond, Reliability & Quality
This role has been open 0 days — well below the 70-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
198
|
Median days open
70 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (198 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 198 |
| Open roles in the wider Process, Fab & Equipment family | 287 | 9500 · 109 employers |
| Median days open | 25 d | 70 d (−45 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: assembly manufacturing flow, process characterization, DOE, Die Attach, Wire Bond, Reliability & Quality
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 35 d
- Renesas Electronics · 20 open roles · median 27 d
- Micron Technology · 18 open roles · median 146 d
- Monolithic Power Systems · 12 open roles · median 188 d
- Intel Corporation · 11 open roles · median 153 d
- onsemi (this employer) · 8 open roles · median 51 d
How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.