ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER) - Seremban, Negeri Sembilan, Malaysia
Originally posted 15 September 2026 by the employer — open 0 days.
About the role
This role involves developing and executing simulation methodologies for semiconductor packages and power modules.
What you'll do
- Perform thermo-mechanical simulations and analyses of semiconductor packages, power modules, and electronic assemblies using finite element analysis (FEA) tools.
- Develop simulation models to evaluate thermal performance, stress, warpage, deformation, and reliability risks.
- Support package and material selection by assessing mechanical integrity and thermal behavior.
- Conduct root-cause investigations and failure analysis through simulation-driven approaches.
- Develop and improve simulation methodologies, modeling techniques, and correlation practices with experimental data.
- Generate technical reports, present simulation findings, and provide recommendations for design improvements.
What you'll need
- Perform thermo-mechanical simulations and analyses of semiconductor packages, power modules, and electronic assemblies using finite element analysis (FEA) tools.
- Develop simulation models to evaluate thermal performance, stress, warpage, deformation, and reliability risks during product development.
- Support package and material selection by assessing mechanical integrity and thermal behavior under various operating conditions.
- Conduct root-cause investigations and failure analysis through simulation-driven approaches.
- Collaborate with cross-functional teams including package design, product engineering, process development, reliability, and manufacturing to optimize product performance.
- Develop and improve simulation methodologies, modeling techniques, and correlation practices with experimental data.
Nice to have
- Bachelor's, Master's, or PhD in Mechanical Engineering, Materials Engineering, Physics, or a related discipline.
- Experience with FEA tools such as ANSYS Mechanical, ANSYS Icepak, Abaqus, COMSOL, or equivalent.
- Knowledge of semiconductor packaging, power modules, thermal management, reliability, and material characterization.
- Experience correlating simulation results with laboratory measurements and reliability testing.
Skills: thermo-mechanical simulations, FEA tools, semiconductor packages, power modules, reliability analysis
This role has been open 0 days — well below the 64-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
203
|
Median days open
64 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (203 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 203 |
| Open roles in the wider Process, Fab & Equipment family | 268 | 9344 · 109 employers |
| Median days open | 60 d | 64 d (−4 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Skills observed across this category: thermo-mechanical simulations, FEA tools, semiconductor packages, power modules, reliability analysis
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 26 d
- Micron Technology · 21 open roles · median 137 d
- Renesas Electronics · 20 open roles · median 18 d
- Intel Corporation · 12 open roles · median 143 d
- Monolithic Power Systems · 12 open roles · median 179 d
- SanDisk · 7 open roles · median 47 d
How we counted: 203 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 15 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.