ENGR II, MANUFACTURING EQUIP; MFG - Seremban, Negeri Sembilan, Malaysia
Originally posted 8 October 2026 by the employer.
About the role
This role involves leading a team of shift technicians to ensure maximum equipment uptime and performing advanced troubleshooting across die bond, clip bond, reflow, and inspection lines within front-end assembly. You will focus on ASM/CANON equipment and front-end assembly processes.
What you'll do
- Lead, supervise, and mentor shift technicians to ensure adherence to maintenance schedules and production KPIs.
- Take ownership of chronic or escalated machine issues, conducting root cause analysis for permanent resolution.
- Oversee and execute corrective and preventive maintenance for die attach, clip bond, reflow, oven, and AOI equipment.
- Monitor and analyze Overall Equipment Effectiveness (OEE), equipment Uptime, and Production Time to maximize line efficiency.
- Reduce maintenance operational costs by optimizing spare parts inventory and implementing component-level repairs.
- Lead continuous improvement initiatives (such as Kaizen, 5S, and Lean Six Sigma projects) to reduce recurring equipment failure rates.
- Collaborate with process engineering teams to analyze defect data, minimizing material waste and scrap.
- Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials.
What you'll need
- Hands-on engineering experience with ASM/CANON equipment and front-end assembly processes.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Die Bonder equipment: ASM AD838, AD8312PLUS, DA D510, ALPHASAM.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Clip Bonder equipment: AD830CB, AD830PLUS, BESTEM-C310.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Reflow & Ovens equipment: RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System).
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Screen Printer equipment: ASM DEK.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Cleaning Systems equipment: CREST.
- Hands-on experience in operation, setup, troubleshooting, or maintenance for Automated Optical Inspection (AOI) equipment: PENTAMASTER AOI.
This role has been open 0 days — well below the 55-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3687
|
Median days open
55 d
|
Median salary
$128k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (3687 roles · 82 employers) |
|---|---|---|
| Open roles in this specialty | 82 | 3687 |
| Open roles in the wider Process, Fab & Equipment family | 264 | 9696 · 108 employers |
| Median days open | 59 d | 55 d (+4 d vs this employer) |
| Median salary (USD postings) | — | $128k |
Who's hiring in this category
- Applied Materials · 604 open roles · median 55 d
- Lam Research · 550 open roles · median 42 d
- Micron Technology · 268 open roles · median 43 d
- KLA Corporation · 258 open roles · median 67 d
- ASML · 193 open roles · median 64 d
- ASM International · 155 open roles · median 78 d
How we counted: 3687 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 82 employers tracked in the SemiconductorJobs index, counted 8 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.