$139,800 - $223,800 USD yearly
Originally posted 1 October 2026 by the employer.
About the role
This role involves leading multi-site, multi-discipline, cross-functional teams to define and deliver committed prototypes, demonstrations, and/or products, utilizing various product development approaches.
What you'll do
- Lead complex hardware and ASIC development programs, coordinating cross-functional teams across engineering, operations, manufacturing, and external partners.
- Track execution through key development milestones including requirements definition, design reviews, silicon tape-out, validation, qualification, and product release.
- Develop the plan, monitor the execution, and lead complex projects, negotiating trade-offs and committing to achievable project outcomes.
- Aggressively drive and monitor all day-to-day project work, ensuring problems are identified and resolved quickly.
- Lead project and phase gate approval reviews, providing clear, concise, and well-synthesized communication to all levels of the project team and stakeholders.
What you'll need
- Bachelor degree, preferably in an Engineering discipline OR equivalent experience.
- 8+ years of Technical Project Management and Product Development experience.
- Experience managing ASIC, semiconductor, FPGA, or complex hardware development programs.
- Familiarity with semiconductor development processes, including design, verification, tape-out, validation, and production ramp.
- Experience working with external technology partners, suppliers, or manufacturing partners.
- Project Management background in multi-functional project environments.
- Training in Project Management with emphasis on project structure and processes.
- Advanced knowledge of Excel, Word, PowerPoint, and Project Scheduling tools.
Nice to have
- Project Management Professional (PMP) Certification preferred.
- Experience managing team in multiple geographic locations.
- Extensive knowledge in at least one major discipline such as Engineering, Operations, and Marketing.
Skills: ASIC development programs, semiconductor development processes, silicon tape-out, validation, qualification
This role has been open 8 days — well below the 46-day median for Technical Program Management roles.
Technical Program Management · Manufacturing Equipment
|
Open roles in category
368
|
Median days open
46 d
|
Median salary
$152k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Teradyne | All employers we track in this specialty (368 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 368 |
| Median days open | 22 d | 46 d (−24 d vs this employer) |
| Median salary (USD postings) | — | $152k |
Skills observed across this category: ASIC development programs, semiconductor development processes, silicon tape-out, validation, qualification
Who's hiring in this category
- Applied Materials · 100 open roles · median 38 d
- Lam Research · 71 open roles · median 35 d
- Micron Technology · 38 open roles · median 118 d
- ASML · 22 open roles · median 51 d
- Teradyne (this employer) · 17 open roles · median 21 d
- KLA Corporation · 13 open roles · median 84 d
How we counted: 368 open Technical Program Management (Manufacturing Equipment) roles from 40 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.