$118,000 - $210,000 USD yearly
Originally posted 14 October 2026 by the employer.
Drive the development and production of analog, mixed-signal, power-management, sensor, and RF IC products.
About the role
This role is for an Engineering Program Manager to drive the development and production of analog, mixed-signal, power-management, sensor, and RF IC products from concept through volume manufacturing. This role operates at the intersection of engineering, product, and operations, driving alignment, execution, and delivery predictability across cross-functional and globally distributed teams.
What you'll do
- Own and drive end-to-end program execution across silicon, IP, and package development.
- Develop and manage integrated program plans, including milestones, dependencies, risks, and critical paths.
- Lead cross-functional coordination across IP, design, packaging, manufacturing, verification, quality, supply chain, and commercial teams.
- Proactively identify risks, bottlenecks, and resource constraints; drive mitigation strategies and timely escalation.
- Provide clear, data-driven status reporting to leadership; facilitate executive reviews and decision-making.
- Drive stakeholder alignment across technical and business domains in a global, matrixed environment.
What you'll need
- Bachelor’s or master’s degree in Electrical/Electronics Engineering or related field.
- 5+ years of experience in semiconductor IP, product, or process development.
- 3+ years in program or technical project management delivering complex programs.
- Proficiency with program management tools (e.g., MS Project, JIRA, Excel).
- Solid understanding of automotive development flows and deliverables (AEC-Q100, PPAP/APQP).
- Experience managing relationships, performance, quality, capacity, cost, and execution with OSAT suppliers.
Nice to have
- Experience with 55LPx CMOS or similar process nodes.
- Background in packaging and/or test engineering.
- Experience with Supplier Quality Management (SQM).
Skills: program execution, silicon, IP, and package development, risk mitigation, AEC-Q100, OSAT suppliers
This role has been open 0 days — well below the 48-day median for Technical Program Management roles.
Technical Program Management · SOC Architecture
|
Open roles in category
167
|
Median days open
48 d
|
Median salary
$219k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (167 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 167 |
| Median days open | 0 d | 48 d (−48 d vs this employer) |
| Median salary (USD postings) | — | $219k |
Skills observed across this category: program execution, silicon, IP, and package development, risk mitigation, AEC-Q100, OSAT suppliers
Who's hiring in this category
- Qualcomm · 26 open roles · median 49 d
- NVIDIA · 19 open roles · median 47 d
- AMD · 18 open roles · median 36 d
- Synopsys · 13 open roles · median 54 d
- Arm Holdings · 10 open roles · median 80 d
- NXP Semiconductors · 6 open roles · median 33 d
How we counted: 167 open Technical Program Management (SOC Architecture) roles from 46 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.