$249,900 - $338,100 USD yearly
Originally posted 23 September 2026 by the employer.
Support System-in-Package development using Cadence APD, Allegro, SKILL, and TCL for 2.5D and 3D package systems.
About the role
This role is for an ECAD Principal Engineer in the System-in-Package team, focusing on tools and process implementation to support package designs across IoT, Automotive, and Compute SoC spaces.
What you'll do
- Assist in the design, development, and deployment of custom tools to support package designs and automate data transfer and checking between teams. - Interface with ECAD vendors regarding development requirements, problem reports, and issue resolutions. - Support library development by building symbols and CAD library databases using Cadence APD tools. - Develop methodologies to improve layout efficiency and perform layout development using best-known practices for DFM, DFA, Signal, and Power Delivery Networks. - Provide use model support to internal team members across design cycle tools.
What you'll need
- An Electrical Engineering degree or equivalent work experience. - Experience with 2.5D and 3D package systems and layout process improvements. - 15+ years of recent experience using Cadence APD and Allegro toolsets (with recent experience using V24 and V25), Siemens HyperLynx, Ansys, and Valor. - Substantial programming experience with languages such as SKILL, TCL, Ravel, Codex, and Python. - Significant experience in the design, development, and deployment of custom tools in large layout installations. - Demonstrated background in product support, internal regression testing, and related techniques.
Nice to have
- Experience with Siemens Expedition, Calibre, Innovus, and related tools. - Ability to use SI/PI tools, run early analysis, and provide feedback.
Skills: Cadence APD, Allegro, SKILL, TCL, 2.5D, 3D packaging
This role has been open 0 days — well below the 67-day median for EDA/CAD Engineering roles.
EDA/CAD Engineering · EDA Tools
|
Open roles in category
726
|
Median days open
67 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Arm Holdings | All employers we track in this specialty (726 roles · 74 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 726 |
| Open roles in the wider Physical Implementation family | 43 | 1561 · 112 employers |
| Median days open | 0 d | 67 d (−67 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Skills observed across this category: Cadence APD, Allegro, SKILL, TCL, 2.5D, 3D packaging
Who's hiring in this category
- Cadence Design Systems · 157 open roles · median 153 d
- Synopsys · 64 open roles · median 44 d
- Micron Technology · 48 open roles · median 48 d
- GlobalFoundries · 40 open roles · median 29 d
- Qualcomm · 38 open roles · median 79 d
- Renesas Electronics · 36 open roles · median 6 d
How we counted: 726 open EDA/CAD Engineering (EDA Tools) roles from 74 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Physical Implementation family row. Figures refresh nightly.