DMTS Process Development Engineer, Advanced Packaging - Boise, ID - Main Site
Originally posted 21 September 2026 by the employer — open 0 days.
About the role
This role involves leading and influencing methodology improvements in process development, data-driven decision-making, and the application of AI/advanced analytics.
What you'll do
- Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness.
- Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs.
- Drive structured problem solving for multi‑domain technical challenges and guide strategic decisions across programs.
- Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams.
What you'll need
- MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience).
- 15+ years in semiconductor process development, manufacturing, or advanced packaging.
- Deep expertise in wafer‑level or die‑level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding.
- Strong understanding of semiconductor process integration and materials interactions.
- Proven experience leading complex cross‑functional technical programs.
Nice to have
- PhD in a relevant technical field.
- Extensive experience with advanced memory technologies or 3D packaging architectures.
- Experience mentoring other engineers and driving technical methodology improvements.
- Familiarity with materials characterization and simulation (thermal, mechanical, electrical).
This role has been open 0 days — well below the 58-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
68
|
Median days open
58 d
|
Median salary
$175k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (68 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 14 | 68 |
| Open roles in the wider Process, Fab & Equipment family | 1462 | 9417 · 108 employers |
| Median days open | 102 d | 58 d (+44 d vs this employer) |
| Median salary (USD postings) | — | $175k |
Who's hiring in this category
- Micron Technology (this employer) · 14 open roles · median 102 d
- GlobalFoundries · 10 open roles · median 91 d
- Intel Corporation · 9 open roles · median 31 d
- Applied Materials · 8 open roles · median 28 d
- Renesas Electronics · 5 open roles · median 67 d
- Lumilens · 4 open roles · median 46 d
How we counted: 68 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.