About the role

This role involves leading technical sales campaigns for 3DIC solutions across strategic semiconductor accounts.

What you'll do

Lead technical sales campaigns for 3DIC solutions across strategic semiconductor accounts.
Drive customer discovery sessions to uncover technical requirements, business drivers, and solution fit.
Serve as the primary business and sales focal point for 3DIC opportunities.
Build and maintain executive and technical relationships across customer organizations.
Work directly with Applications Engineering teams to align proof-of-concept activities, evaluations, and deployments.
Track campaign progress, opportunity health, and forecasting accuracy using Salesforce.

5+ years of experience in EDA sales, Applications Engineering, or Product Specialist roles with a strong technical foundation in semiconductor design or advanced packaging technologies.
Direct experience in the 3D IC market segment, including familiarity with chiplet architectures, advantage packaging (interposer) and substrate design, and System Technology Co-Optimization (STCO).
Proven ability to manage long-term enterprise sales engagements, including multi-quarter technical campaigns.
Strong relationship-building skills with a track record of developing executive and technical relationships.
Ability to collaborate internally with Product Management and R&D teams to align customer requirements with product capabilities and roadmaps.
Willingness to travel up to 30% to customer sites, industry events, and internal meetings.
Experience using CRM systems like Salesforce to track opportunities, forecast accurately, and provide visibility into campaign progress.

Skills: technical sales campaigns, 3DIC solutions, advanced packaging, chiplet architectures, System Technology Co-Optimization