Director, Technical Package Development - Boise, ID - Main Site, United States
Originally posted 9 September 2026 by the employer — open 11 days.
This role focuses on DRAM packaging solutions.
About the role
This role involves leading the strategy, development, and execution of advanced packaging solutions across Micron's memory portfolio.
What you'll do
- Define and execute long-term DRAM packaging strategies that support future product, technology, and business objectives.
- Lead development and deployment of advanced packaging technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, and chiplets.
- Drive adoption of AI, machine learning, advanced analytics, and digital engineering approaches.
- Build, develop, and lead a global packaging organization.
- Partner with design, product engineering, manufacturing, quality, supply chain, and technology development teams.
- Establish and maintain strategic relationships with customers, OSAT partners, foundries, suppliers, equipment vendors, and research institutions.
What you'll need
- Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field.
- 15+ years of semiconductor packaging experience, including delivery of advanced packaging technologies from development through high-volume manufacturing.
- 10+ years of experience leading engineering teams, complex technology programs, or global engineering organizations.
- Demonstrated expertise in advanced packaging technologies, including HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration, or related platforms.
- Proven experience driving business-critical technology decisions through technical analysis, risk assessment, and multi-functional collaboration.
Nice to have
- Master’s degree or PhD in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field.
- Experience implementing AI, machine learning, advanced analytics, or digital engineering solutions.
- Experience leading digital transformation initiatives involving automation, data science, and engineering productivity improvements.
- Experience representing an organization at industry forums, customer meetings, or technical conferences.
- Demonstrated record of innovation through patents, industry publications, or conference presentations.
- Experience developing future technology roadmaps and influencing strategic direction across engineering and business organizations.
- Experience developing Agentic AI workflows into current or future processes.
Skills: DRAM packaging, HBM, LPDRAM, 2.5D/3D integration, chiplets, heterogeneous integration
This role has been open 11 days — well below the 38-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
67
|
Median days open
38 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (67 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 67 |
| Median days open | 143 d | 38 d (+105 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Skills observed across this category: DRAM packaging, HBM, LPDRAM, 2.5D/3D integration, chiplets, heterogeneous integration
Who's hiring in this category
- Micron Technology (this employer) · 13 open roles · median 143 d
- AMD · 6 open roles · median 27 d
- Marvell Technology · 6 open roles · median 13 d
- Broadcom · 5 open roles · median 163 d
- NVIDIA · 5 open roles · median 38 d
- Amazon · 4 open roles · median 26 d
How we counted: 67 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.