Director Product Line Management (Co Packaging Optical Solution) - San Jose
Originally posted 1 September 2026 by the employer.
About the role
The Director Product Line Management (Co Packaging Optical Solution) leads the execution of product development programs for high-speed optical network hardware. In this role, you will work across internal engineering disciplines, suppliers, and contract manufacturers to take co-packaged optical products through design verification and production release.
What you'll do
- Drive execution of product development programs across development teams for optical hardware products serving high-speed optical networks. - Partner with development teams to identify technical gaps and establish solutions to meet committed production launches. - Manage manufacturing partners to ensure completion of technical design activities, including reliability, Design Verification Test (DVT), compliance testing, and reporting. - Collaborate with cross-functional teams across Photonics Design, HW design, Packaging, Manufacturing, Quality Engineering, Product Marketing, and Supply Chain to transfer products to production. - Drive material readiness and supplier technical engagements to support ongoing customer programs and incoming component validation. - Prepare, present, and document technical reviews, reliability reports, and risk assessments for internal and customer-facing engagements.
What you'll need
- M.S. in Electrical Engineering, Photonics, Physics, Materials Science, or related field (or equivalent experience in photonics reliability engineering). - Direct exposure to optical systems, Silicon Photonics, laser technologies, and optical transceivers. - Deep knowledge of photonics device physics, photonics packaging, and failure mechanisms. - Demonstrated success supporting NPI programs and product qualification from concept through volume production in telecom/datacom markets. - In-depth knowledge of industry qualification standards, including GR-468, Telcordia, JEDEC, and MIL-STD.
Nice to have
- Project management experience in integrated photonics packaging and co-design (optical + electrical) from design to production release. - Hands-on experience in design for manufacturability and cost. - Willingness to travel to suppliers and manufacturing partners during product design and transfer phases.
This role has been open 50 days — below the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1003
|
Median days open
51 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lumilens | All employers we track in this specialty (1003 roles · 104 employers) |
|---|---|---|
| Open roles in this specialty | 29 | 1003 |
| Open roles in the wider Software, Firmware & Systems family | 38 | 6291 · 145 employers |
| Median days open | 76 d | 51 d (+25 d vs this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation · 72 open roles · median 34 d
- KLA Corporation · 63 open roles · median 48 d
- Teradyne · 61 open roles · median 34 d
- NVIDIA · 53 open roles · median 72 d
- Applied Materials · 51 open roles · median 70 d
- AMD · 46 open roles · median 52 d
How we counted: 1003 open Hardware Systems Engineering (AI ML Hardware) roles from 104 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.