Director of Analog and Mixed-Signal IC Design - Austin, Texas, United States

Originally posted 2 October 2026 by the employer.

Join our team focused on high-speed ADCs and DACs, SerDes, and millimeter-wave circuits.

About the role

Neurophos is seeking a Director of Analog and Mixed-Signal IC Design to build and lead the team responsible for the electronic circuits that drive, sense, and connect our optical processing unit. Our OPU depends on dense, energy-efficient electronics operating in close partnership with photonics, including high-speed data converters, low-power analog front ends, clocking, power management, and high-bandwidth links.

What you'll do

• Build, lead, and mentor a team of analog, mixed-signal, RF/mmWave, and layout engineers; recruit talent and foster a culture of technical rigor, ownership, and collaboration.
• Define the architecture and specifications for analog and mixed-signal IP, including high-speed ADCs and DACs, modulator drivers, transimpedance amplifiers, analog front ends, PLLs, clock generation/distribution, SerDes, high-speed I/O, voltage references, and on-chip regulators.
• Own silicon through the full lifecycle: specification, schematic and layout, verification, tape-out, silicon bring-up, characterization, qualification, and production release.
• Collaborate with the photonics team and oversee the development of millimeter-wave circuits and interfaces, including transceivers, LNAs, PAs, mixers, VCOs, and high-frequency passives, with a focus on EM modeling and package co-design.
• Maintain disciplined design data management; establish and enforce robust design methodologies: PVT and Monte Carlo analysis, reliability (EM/IR, aging, ESD, latch-up), mismatch and noise budgeting, and rigorous design reviews.
• Drive design-for-manufacturability and design-for-test, working with test engineering to define strategy, trim and calibration schemes, and production test coverage.

What you'll need

• 15+ years of experience in analog, mixed-signal, and/or RF IC design, including 5+ years leading design teams at the manager or director level.
• Proven track record of bringing analog/mixed-signal products from concept through tape-out and validation into high-volume production, including qualification, yield ramp, and production test.
• Deep, hands-on expertise in low-power, high-precision analog and high-speed mixed-signal design, including data converters, PLLs, high-speed transceivers, and amplifiers.
• Demonstrated experience with millimeter-wave or high-frequency RF circuit design and the associated EM simulation, modeling, and measurement techniques.
• Strong working knowledge of advanced CMOS, FinFET, and/or SiGe BiCMOS process technologies and their implications for analog performance and reliability.
• Proficiency with industry-standard design and verification flows, including Cadence Virtuoso and Spectre and EM tools such as EMX.
• Experience working with foundries and OSATs, and a solid understanding of DFT, ATE test development, trimming and calibration, and failure analysis.

Nice to have

• PhD in Electrical Engineering, Computer Engineering, Physics, or related fields.
• Experience designing electronics for integrated photonics or optical interconnects, such as modulator drivers, TIAs, laser drivers, or co-packaged optics.
• Background in electronic-photonic co-design, including heterogeneous integration or 3D stacking of electronic and photonic dies.
• Experience with high-speed (e.g., 112G/224G PAM4 SerDes) wireline standards or mmWave wireless/radar products.
• Experience with ultra-low-power circuit techniques, including subthreshold design, dynamic power management, and energy-efficient data conversion.
• Familiarity with advanced packaging, signal and power integrity, and chip-package-board co-simulation.
• Experience building a team and supporting infrastructure in a startup setting.
• A record of patents, publications, or recognized contributions.

Skills: Analog IC Design, Mixed-Signal IC Design, high-speed ADCs and DACs, SerDes, millimeter-wave circuits