Director, Advanced Product Engineering - Livermore, CA, United States
$192,400 - $252,525 USD yearly
Originally posted 11 July 2026 by the employer.
About the role
The Director, Advanced Product Engineering drives the development and delivery of advanced cooling solutions for probe card technologies. This role defines the technical vision and roadmap for thermal solutions while leading engineering teams aligned with product, manufacturing, and business objectives.
What you'll do
- Lead the architecture, design, and development of cooling solutions for probe card technologies. - Define and own the thermal technology strategy and multi-year roadmap aligned to business objectives. - Lead, develop, and scale an engineering team, driving resource planning, prioritization, and organizational design. - Establish and track engineering Key Performance Indicators (KPIs) and manage development programs using Product Life Cycle (PLC) methodology. - Develop and evaluate new concepts for heat removal, temperature uniformity, and thermal stability. - Collaborate with manufacturing to build prototypes, alpha, and beta probe cards, owning schedule, cost, and technical performance outcomes.
What you'll need
- Minimum of 12+ years of relevant experience in leadership roles with a Bachelor's degree, 10+ years with a Master's degree, or 8+ years with a PhD in an engineering field. - Experience leading engineering teams in semiconductor, electronics cooling, or related advanced product development environments. - Direct background in thermal management, heat transfer, or electronics cooling solutions. - Technical proficiency in development and modeling tools such as Computational Fluid Dynamics (CFD), FEA software, MATLAB, Python, SolidWorks, or AutoCAD 3D. - Experience applying Geometric Dimensioning and Tolerancing (GD&T) and managing error budgets.
Nice to have
- MS or Ph.D. in Mechanical Engineering or a related engineering field. - 10+ years of relevant experience in thermal management, electronics cooling, semiconductor equipment, or related advanced product development environments. - Demonstrated success leading engineering teams in semiconductor or electronics cooling industries.
This role has been open 127 days — well above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1011
|
Median days open
51 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | FormFactor | All employers we track in this specialty (1011 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 1011 |
| Open roles in the wider Software, Firmware & Systems family | 17 | 6286 · 144 employers |
| Median days open | 49 d | 51 d (−2 d vs this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation · 74 open roles · median 35 d
- KLA Corporation · 63 open roles · median 49 d
- Teradyne · 60 open roles · median 35 d
- NVIDIA · 52 open roles · median 70 d
- Applied Materials · 49 open roles · median 70 d
- AMD · 45 open roles · median 52 d
How we counted: 1011 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.