$223,000 - $319,660 USD yearly
Originally posted 28 July 2026 by the employer.
Focus on new applications requiring advanced packaging, Vertical Timing Delivery, 2.5D and 3D integration, and other new approaches to integrating precision timing.
About the role
This role involves identifying and developing new opportunities for SiTime across advanced AI markets, spanning new applications in data center and AI infrastructure, edge AI, automotive AI, robotics, drones, autonomous systems, and other emerging AI platforms. The scope includes opportunities requiring advanced packaging, Vertical Timing Delivery, 2.5D and 3D integration to integrate precision timing into advanced AI systems.
What you'll do
- Identify and develop new business opportunities in advanced AI markets, emphasizing applications not currently addressed by established business units.
- Discover and validate new applications in data center and AI infrastructure, edge AI, automotive AI, robotics, drones, autonomous systems, and other emerging AI platforms.
- Develop opportunities in AI applications requiring advanced packaging, including 2.5D and 3D integration, interposers, package substrates, co-packaged architectures, heterogeneous integration, and Vertical Timing Delivery.
- Translate unmet customer needs and emerging system requirements into new product concepts, product requirements, roadmap priorities, and investment recommendations.
- Build business cases for new advanced AI opportunities, including TAM, SAM, SOM analysis, customer validation, competitive assessment, pricing strategy, investment requirements, and long-range revenue potential.
- Develop relationships with advanced AI innovators, system architects, semiconductor companies, packaging partners, and other ecosystem participants.
What you'll need
- 15+ years of experience in product marketing, product management, product line management, or strategic business leadership within the semiconductor industry.
- Director-level experience driving product strategy, roadmap development, go-to-market execution, business planning, and customer engagement.
- Proven success owning product portfolios and delivering sustained revenue growth, market share gains, and successful new product introductions.
- Experience identifying and developing new semiconductor applications in advanced AI, high-performance computing, edge AI, automotive, robotics, drones, autonomous systems, or adjacent markets.
- Experience engaging advanced AI companies, system architects, semiconductor partners, packaging partners, or strategic ecosystem participants.
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline.
Nice to have
- Experience with timing, clocking, synchronization, IEEE 1588, SyncE, networking, or communications infrastructure technologies.
- Experience with analog, mixed-signal, power management, connectivity, or infrastructure semiconductor products.
- Experience with advanced packaging, 2.5D or 3D integration, heterogeneous integration, interposers, package substrates, or co-packaged solutions.
- MBA or advanced technical degree.
Skills: product strategy, roadmap development, go-to-market, data center, AI infrastructure