Die-to-Die (D2D) Applications Engineer - USA-Colorado-Fort Collins-4380 Ziegler Road, United States
$91,100 - $146,000 USD yearly
Originally posted 17 September 2026 by the employer — open 0 days.
About the role
This role involves serving as the primary technical resource for internal and external customers integrating and deploying proprietary D2D PHY IP in silicon.
What you'll do
- Provide technical support to customers integrating D2D PHY IP into ASICs and products.
- Debug and resolve Verilog/RTL simulation issues during customer integration.
- Support internal DFT and ATE production test development teams with PHY-specific technical guidance.
- Assist external customers with silicon bring-up, characterization, and production test/debug support.
- Triage and resolve firmware-related issues from customers using the PHY’s embedded software/firmware stack.
- Diagnose issues that span RTL, firmware, and system/software to identify root cause across hardware/software boundaries.
What you'll need
- Bachelor’s Degree in Electrical or Computer Engineering or equivalent, and 5+ years of related experience; or Master’s degree and 3+ years of related experience.
- Hands-on experience running and debugging Verilog simulations.
- Strong debugging skills across at least two of the following domains: RTL/digital logic, firmware, embedded software, or system-level hardware.
- Comfort working at the intersection of hardware and software, able to trace an issue from a software/firmware symptom down to a hardware or RTL root cause (or vice versa).
- Solid understanding of digital design fundamentals and standard chip-level interfaces/protocols.
- Scripting skills (Python, Ruby, Tcl) for debug automation and log analysis.
- Familiarity with embedded firmware development or debug (C/C++, register-level debug, on-chip debug tools).
Nice to have
- Direct experience with Die-to-Die (D2D) PHY IP, chiplet interconnects, or other high-speed SerDes/PHY IP.
- Experience with silicon bring-up, lab debug equipment (oscilloscopes, logic analyzers, protocol analyzers), and characterization.
- Experience supporting DFT and/or ATE test development (scan, BIST, test pattern debug).
- Prior experience in an applications engineering, field applications engineering (FAE), or customer-facing technical support role.
Skills: D2D PHY IP, RTL integration, silicon bring-up, firmware, ATE production test
This role has been open 0 days — well below the 50-day median for Applications FAE roles.
Applications FAE · Serdes Highspeed
|
Open roles in category
74
|
Median days open
50 d
|
Median salary
$183k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Broadcom | All employers we track in this specialty (74 roles · 23 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 74 |
| Median days open | 48 d | 50 d (−2 d vs this employer) |
| Median salary (USD postings) | — | $183k |
Skills observed across this category: D2D PHY IP, RTL integration, silicon bring-up, firmware, ATE production test
Who's hiring in this category
- Astera Labs · 13 open roles · median 92 d
- Synopsys · 13 open roles · median 2 d
- Keysight Technologies · 6 open roles · median 20 d
- Microchip Technology · 6 open roles · median 65 d
- Qualcomm · 6 open roles · median 91 d
- Broadcom (this employer) · 3 open roles · median 58 d
How we counted: 74 open Applications FAE (Serdes Highspeed) roles from 23 employers tracked in the SemiconductorJobs index, counted 17 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.