Device Compact Modeling Engineer (2027 New College Graduate) - USA - Texas - Austin, United States

Originally posted 30 September 2026 by the employer.

About the role

This position is for a Device Compact Modeling Engineer who will primarily work on digital, analog, and RF compact device model development for GF CMOS technologies.

What you'll do

• Work on SPICE model development projects for digital, analog, and RF devices for GF CMOS technologies.
• Drive best practices and standardization in data selection, model extraction, QA, validation, and circuit benchmarking.
• Coordinate cross-functional teams including Device Modeling, Characterization Labs, PDK, Device Engineering, Process Integration, Design Manual, and Test Chip Design/Layout.
• Stay current on industry trends and advancements in SPICE modeling methodologies.
• Communicate project progress and provide technical updates to stakeholders.
• Participate in customer engagement activities and provide technical support for compact model questions, investigations, and issue resolution.

What you'll need

• Bachelor’s degree in Electrical Engineering, Physics or related field.
• Overall 3.0 GPA.
• Fundamental knowledge of semiconductor device physics related to compact modeling.
• Understanding of semiconductor device noise and matching behaviors.

Nice to have

• Prior related internship or co-op experience.
• Experience with analog or RF design flow and methodology.
• Coding skills in Python, Perl, or other computing languages.
• Experience in machine learning and artificial intelligence.
• Experience in SPICE model generation and QA flow.
• Experience in test structure layout of individual devices and arrays.

Skills: SPICE model development, compact modeling, device physics, model extraction, circuit benchmarking