Defect Characterization Low Yield Analysis Engineer - Arizona, Phoenix, United States
$133,800 - $188,890 USD yearly
Originally posted 7 October 2026 by the employer.
About the role
As a Defect Characterization Low Yield Analysis Engineer, you will drive root cause identification and yield improvement strategies for advanced packaging assembly and substrate technology development programs. This role involves leading complex technical investigations and developing innovative characterization methodologies.
What you'll do
- Lead end-to-end investigations to identify and resolve complex yield, defect, and quality issues.
- Define characterization strategies, learning plans, and root cause methodologies for critical technical challenges.
- Utilize advanced analytical techniques including Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms.
- Correlate characterization results with electrical data, defect inspection data, process history, and manufacturing information to establish root cause.
- Consolidate and analyze large data sets using statistical methods and coding tools to identify yield limiters and emerging trends.
- Drive corrective actions and influence process improvements across manufacturing, integration, quality, and technology organizations.
What you'll need
- Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field with 3+ years of relevant semiconductor industry or failure analysis lab experience OR PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field.
Nice to have
- Prior experience working in a lab environment with hands-on experience with failure analysis and characterization techniques such as Optical Microscopy, SEM/EDS, CSAM, FTIR, Raman, TEM, EBSD, XRD or similar methodologies.
- Experience with mechanical cross-sectioning, planar grinding, ion milling, focused ion beam (FIB), and advanced sample preparation techniques.
- Advanced knowledge of semiconductor packaging, assembly, substrate manufacturing, or related process technologies.
- Proficiency with statistical analysis and data analytics tools such as Python, JMP, JSL, SQL, or equivalent.
- Experience developing new characterization techniques, analytical workflows, or problem-solving methodologies.
Skills: Low Yield Analysis, defect characterization, root cause identification, advanced packaging assembly, SEM/EDS, FIB
This role has been open 2 days — well below the 48-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
188
|
Median days open
48 d
|
Median salary
$116k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (188 roles · 39 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 188 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9729 · 107 employers |
| Median days open | 38 d | 48 d (−10 d vs this employer) |
| Median salary (USD postings) | — | $116k |
Skills observed across this category: Low Yield Analysis, defect characterization, root cause identification, advanced packaging assembly, SEM/EDS, FIB
Who's hiring in this category
- Micron Technology · 33 open roles · median 66 d
- Lam Research · 14 open roles · median 44 d
- GlobalFoundries · 12 open roles · median 17 d
- Infineon Technologies · 12 open roles · median 41 d
- AMD · 11 open roles · median 71 d
- Intel Corporation (this employer) · 11 open roles · median 30 d
How we counted: 188 open Failure Analysis Engineering (Failure Analysis) roles from 39 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.