$116,000 - $189,750 USD yearly
Originally posted 28 August 2026 by the employer.
About the role
This role involves collaborating with hardware design teams to enable NVIDIA's Embedded products and system solutions.
What you'll do
- Collaborate with major Tier-1 and OEM customers and internal teams to develop future Embedded architectures and roadmaps.
- Work with hardware design, firmware, software, sensors validation, and AI algorithm teams to integrate NVIDIA's Embedded solutions.
- Define system-level requirements and specifications for Embedded architectures using NVIDIA SoC solutions.
- Evaluate and enhance system performance, power efficiency, and thermomechanical integration.
- Provide internal teams with feedback for future product improvements.
What you'll need
- Expertise in thermal, mechanical, and electrical (TME) engineering.
- Experience with board design and integration of large-scale Automotive and Robotic systems.
- 3+ years of overall experience.
- BS or equivalent degree in EE/CE/CS engineering field or equivalent experience.
- Track record of leading a team and working with multidisciplinary groups (hardware, firmware, software, validation, project management, sensors, and AI algorithm developers).
- In-depth knowledge of AI hardware products and applications.
Skills: Partner Enablement, customer engagement, Embedded solutions, AI hardware products, system-level requirements, thermal, mechanical, and electrical (TME)
This role has been open 46 days — well below the 99-day median for Applications FAE roles.
Applications FAE · Automotive IC
|
Open roles in category
143
|
Median days open
99 d
|
Median salary
$152k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NVIDIA | All employers we track in this specialty (143 roles · 26 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 143 |
| Median days open | 129 d | 99 d (+30 d vs this employer) |
| Median salary (USD postings) | — | $152k |
Skills observed across this category: Partner Enablement, customer engagement, Embedded solutions, AI hardware products, system-level requirements, thermal, mechanical, and electrical (TME)
Who's hiring in this category
- Infineon Technologies · 33 open roles · median 65 d
- NXP Semiconductors · 24 open roles · median 85 d
- Texas Instruments · 16 open roles · median 232 d
- Microchip Technology · 10 open roles · median 207 d
- Renesas Electronics · 10 open roles · median 120 d
- Qualcomm · 7 open roles · median 23 d
How we counted: 143 open Applications FAE (Automotive IC) roles from 26 employers tracked in the SemiconductorJobs index, counted 15 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.