Originally posted 3 November 2026 by the employer.

About the role

What you'll do

Lead HBM enablement for strategic AI customers, aligning system requirements, qualification plans, development milestones, risks, and product readiness.
Partner with customers and cross-functional teams to drive product introduction, validation, qualification, and high-volume production.
Translate customer needs and emerging AI infrastructure trends into HBM product, roadmap, enablement, and business priorities.
Turn insights across customer engagements into recommendations that improve products, processes, business cases, and customer outcomes.
Use AI, analytics, automation, and dashboards to streamline workflows, identify trends and risks, improve knowledge sharing, and provide leadership visibility.

Master’s degree in engineering or a related technical discipline.
8+ years of experience in semiconductor, memory, systems, or a related technology industry.
Experience in product management, product planning, technical customer management, or customer enablement.
Experience leading cross-functional technical programs across engineering disciplines and communicating complex topics to customers and executives.
Strong written and verbal English communication skills and ability to travel domestically and internationally.

Experience with DRAM, HBM, semiconductor manufacturing, advanced packaging, or AI hardware systems.
Experience applying AI, automation, or data analytics to engineering, product, or customer-facing workflows.
Experience turning complex technical and customer data into structured insights and executive recommendations.
Experience with automated reporting, dashboards, workflow automation, knowledge management, or decision-support tools.

Skills: HBM, product management, enablement, roadmap, AI systems

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