Component Process Engineer - San Jose, United States
Originally posted 22 July 2026 by the employer.
This role focuses on FR4 substrate or PCB from new technology development, process development to qualification of the suppliers.
About the role
This role is for a Component Process Engineer to serve as the primary substrate engineering interface between hardware design teams, package manufacturing teams and worldwide substrate suppliers.
What you'll do
- Identify, develop and qualify FR4/PCB substrate suppliers worldwide.
- Lead DFM/DFT/DFR of PCB substrates, risk analysis and mitigation plan with suppliers.
- Lead FR4/PCB quality control, failure analysis and reliability tests.
- Engage with packaging production teams during the process development from SMT, die attach, wire bond, active alignment and testing.
What you'll need
- B.S. or M.S. in Material, Chemistry or Mechanical Engineering.
- 8+ years of working experience in FR4 substrate or PCB development or manufacturing.
- In-depth knowledge of mSAP process and Any-Layer HDI process for high-speed optical transceiver applications.
- Familiarity with PCB layout tools such as Cadence, mechanical design tools such as Solidworks, and statistical tools such as JMP.
- Working knowledge of PCB test methodologies.
- Familiarity with FMEA, Control Plan, SPC, and 8D.
- Fluency in English.
Nice to have
- M.S. in Electrical or Manufacturing Engineering.
- Experience with optical transceiver manufacturing process such as SMT, die attach, wire bonding and active alignment.
- Six Sigma, Statistical Analysis skills.
Skills: FR4 substrate, PCB development, mSAP/HDI process, optical transceiver, supplier qualification
This role has been open 73 days — well above the 60-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
205
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Lumilens | All employers we track in this specialty (205 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 205 |
| Open roles in the wider Process, Fab & Equipment family | 49 | 9897 · 109 employers |
| Median days open | 73 d | 60 d (+13 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: FR4 substrate, PCB development, mSAP/HDI process, optical transceiver, supplier qualification
Who's hiring in this category
- Renesas Electronics · 27 open roles · median 33 d
- Infineon Technologies · 24 open roles · median 48 d
- Micron Technology · 23 open roles · median 131 d
- onsemi · 13 open roles · median 26 d
- Monolithic Power Systems · 11 open roles · median 212 d
- Intel Corporation · 9 open roles · median 103 d
How we counted: 205 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 18 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.