CMOS FEOL Reliability Principal Engineer (2027 New College Graduate)
$85,000 - $146,000 USD yearly
Originally posted 28 September 2026 by the employer.
About the role
This role supports CMOS FEOL reliability qualification, reliability physics, and lifetime modeling across advanced semiconductor technologies.
What you'll do
- Support reliability qualification planning and execution for advanced semiconductor technologies.
- Analyze reliability mechanisms including Hot Carrier Injection (HCI), Bias Temperature Instability (BTI), Time-Dependent Dielectric Breakdown (TDDB), dielectric breakdown, SRAM reliability, non-volatile memory reliability, and power-device reliability.
- Develop and review reliability models, lifetime extrapolations, and statistical analyses that support technology and product qualification decisions.
- Support definition and continuous improvement of Process Reliability Monitoring strategies, methodologies, and data-analysis workflows.
- Collaborate with cross-functional teams to investigate issues and drive technical actions to closure.
- Perform technical risk assessments and prepare data-driven recommendations for qualification readiness and product-release reviews.
What you'll need
- Bachelor’s, Master’s, or PhD in Electrical Engineering, Physics, Materials Science, Microelectronics, or a related field.
- Overall 3.0 GPA.
- Academic, research, internship, or project experience related to semiconductor reliability, device engineering, technology qualification, semiconductor physics, or data analysis.
- Foundational understanding of CMOS reliability mechanisms, statistical analysis, and reliability lifetime projections.
Nice to have
- Prior related internship or co-op experience.
- Graduate-level research or project experience with advanced CMOS technologies, FinFET or FDSOI platforms, SRAM, non-volatile memory, RF, analog, or power devices.
- Knowledge of automotive reliability standards, including AEC-Q100.
- Experience with Process Reliability Monitoring, reliability model development, semiconductor qualification methodologies, or customer-facing technical reviews.
- Experience using JMP, Python, MATLAB, Excel, or equivalent tools for reliability data analysis and visualization.
Skills: reliability qualification, Hot Carrier Injection (HCI), Bias Temperature Instability (BTI), Time-Dependent Dielectric Breakdown (TDDB), reliability models
This role has been open 17 days — well below the 57-day median for Reliability Engineering roles.
Reliability Engineering · Reliability Engineering
|
Open roles in category
423
|
Median days open
57 d
|
Median salary
$158k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (423 roles · 70 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 423 |
| Open roles in the wider Process, Fab & Equipment family | 350 | 9907 · 109 employers |
| Median days open | 23 d | 57 d (−34 d vs this employer) |
| Median salary (USD postings) | — | $158k |
Skills observed across this category: reliability qualification, Hot Carrier Injection (HCI), Bias Temperature Instability (BTI), Time-Dependent Dielectric Breakdown (TDDB), reliability models
Who's hiring in this category
- Micron Technology · 76 open roles · median 140 d
- Infineon Technologies · 31 open roles · median 43 d
- Renesas Electronics · 20 open roles · median 42 d
- Analog Devices · 18 open roles · median 56 d
- onsemi · 18 open roles · median 74 d
- STMicroelectronics · 18 open roles · median 23 d
How we counted: 423 open Reliability Engineering (Reliability Engineering) roles from 70 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.