CDI - Flip-Chip Process Development Engineer - Advanced Packaging & Photonics F/H - Grenoble, France
Originally posted 13 August 2026 by the employer.
This role focuses on Flip-Chip processes for Advanced Packaging – Photonics products.
About the role
This role involves developing, qualifying, and industrializing Flip-Chip processes for STMicroelectronics’ Advanced Packaging – Photonics products. The position ensures the quality, performance, and competitiveness of future product/package generations.
What you'll do
- Develop and optimize Flip-Chip processes for Advanced Packaging – Photonics products.
- Define, execute, and analyze design of experiments (DOE).
- Evaluate new equipment and materials at Grenoble or supplier plants.
- Support the Grenoble Pilot Line in prototype manufacturing.
- Drive process validation through reliability standards.
- Ensure technology transfer and production ramp-up support at ST Back-End sites.
What you'll need
- Master or PhD degree in Materials science and metallurgy, or a related field.
- Experience in process development or industrialization.
- Knowledge of Flip-Chip Packaging, Photonics, and/or Advanced Packaging.
- Proficiency in DOE and statistical analysis.
- Experience with FMEA / risk management.
- Experience with failure analysis methodologies.
This role has been open 1 day — well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
309
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | STMicroelectronics | All employers we track in this specialty (309 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 309 |
| Open roles in the wider Process, Fab & Equipment family | 254 | 9571 · 109 employers |
| Median days open | 16 d | 60 d (−44 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 52 open roles · median 115 d
- Micron Technology · 36 open roles · median 36 d
- Renesas Electronics · 20 open roles · median 29 d
- Infineon Technologies · 17 open roles · median 52 d
- onsemi · 15 open roles · median 25 d
- Intel Corporation · 14 open roles · median 62 d
How we counted: 309 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 4 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.