Capital Equipment Hardware engineer - Advanced Packaging - Santa Clara, CA, United States
$124,000 - $171,000 USD yearly
Originally posted 3 August 2026 by the employer.
Support the installation, startup, and operation of the Kinex™ Hybrid Bonding platform.
About the role
This role involves supporting the installation, startup, qualification, and ongoing operation of capital equipment for advanced packaging development programs, specifically the Kinex™ Hybrid Bonding platform.
What you'll do
- Coordinate Kinex installation activities from tool dock through release to engineering users.
- Perform troubleshooting of mechanical, electrical, automation, and process-related issues.
- Drive root cause investigations and corrective actions for equipment performance.
- Act as the primary technical interface with BESI and Kinex product engineering teams.
- Support hybrid bonding process development activities and new module integration.
What you'll need
- BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline.
- 3–7 years of engineering experience in semiconductor equipment.
- Strong troubleshooting and root-cause analysis skills.
- Ability to work across facilities, vendors, process engineering, and operations teams.
- Experience supporting semiconductor manufacturing or development equipment.
Nice to have
- Experience with advanced packaging equipment, hybrid bonding, wafer bonding, or die attach systems.
- Experience with wet clean processes and systems.
- Equipment installation and startup experience.
- Facilities hookup and utility integration experience.
- Knowledge of automated material handling systems, vacuum systems, or plasma processing systems.
This role has been open 76 days — slightly above the 72-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
80
|
Median days open
72 d
|
Median salary
$178k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (80 roles · 22 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 80 |
| Open roles in the wider Process, Fab & Equipment family | 1115 | 9897 · 109 employers |
| Median days open | 44 d | 72 d (−28 d vs this employer) |
| Median salary (USD postings) | — | $178k |
Who's hiring in this category
- Micron Technology · 16 open roles · median 36 d
- Applied Materials (this employer) · 11 open roles · median 44 d
- GlobalFoundries · 10 open roles · median 117 d
- Intel Corporation · 10 open roles · median 65 d
- Renesas Electronics · 7 open roles · median 33 d
- Lumilens · 4 open roles · median 72 d
How we counted: 80 open Process Integration (Advanced Packaging) roles from 22 employers tracked in the SemiconductorJobs index, counted 18 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.