AutoTEM technician - Oregon, Hillsboro, United States
$63,090 - $89,060 USD yearly
Originally posted 18 September 2026 by the employer.
About the role
This role involves supporting Intel's technology development efforts by preparing ultra-thin specimens and performing Transmission Electron Microscopy (TEM) analysis. Your work will directly contribute to process development, product qualification, and failure analysis.
What you'll do
- Perform technical functions to support engineering activities like fabrication, process integration, and failure analysis.
- Conduct detailed engineering tasks and technical procedures to prepare samples or capture imaging using advanced FIB and TEM tools.
- Complete work in alignment with general instructions and priorities while exercising judgment in resolving non-standard problems.
- Maintain necessary records and reports for lab activities and ensure adherence to established protocols.
- Continuously upgrade skills through hands-on training and collaboration with peers.
- Participate in lab sustaining efforts, ensuring the availability and maintenance of analytical tools and processes.
What you'll need
- Bachelor's degree in a technical field such as Electrical, Mechanical, Electronics Technology, Materials Science, or a comparable field, with 0-3 years of hands-on lab or manufacturing experience, OR an Associate's degree in a relevant technical field with 6-8 years of lab or manufacturing experience.
- Proficiency in using advanced lab tools, such as dual-beam Focused Ion Beam (FIB) systems and TEM imaging equipment.
- Strong understanding of sample preparation techniques and lab protocols.
Nice to have
- Previous experience working in a semiconductor manufacturing or analytical lab environment.
- Familiarity with laboratory-scale tools and pipetting techniques.
Skills: electron microscopy, ultra-thin specimens, TEM analysis, Focused Ion Beam (FIB), sample preparation
This role has been open 20 days — well below the 48-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
188
|
Median days open
48 d
|
Median salary
$116k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (188 roles · 39 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 188 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9754 · 107 employers |
| Median days open | 38 d | 48 d (−10 d vs this employer) |
| Median salary (USD postings) | — | $116k |
Skills observed across this category: electron microscopy, ultra-thin specimens, TEM analysis, Focused Ion Beam (FIB), sample preparation
Who's hiring in this category
- Micron Technology · 33 open roles · median 66 d
- Lam Research · 14 open roles · median 44 d
- GlobalFoundries · 12 open roles · median 17 d
- Infineon Technologies · 12 open roles · median 41 d
- AMD · 11 open roles · median 71 d
- Intel Corporation (this employer) · 11 open roles · median 30 d
How we counted: 188 open Failure Analysis Engineering (Failure Analysis) roles from 39 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.