Assembly Technical Staff Engineer - China
Originally posted 27 August 2026 by the employer — open 22 days.
About the role
This position focuses on new product development and smooth production, cooperating closely with OSAT, Division, and R&D teams.
What you'll do
- Deploy technical requirements on new subcontractors.
- Define critical process characteristics with subcontractors to fit product characteristics.
- Involve in package maturity (NPI) and automotive readiness projects.
- Develop workable systems and templates.
- Deploy ST technical projects (Inkless Map, STIF, ULT) and manage change.
- Perform package roadmap benchmarking.
What you'll need
- Bachelor's degree or above.
- Over 8 years relevant experience in Semiconductor.
- Proficient in Semiconductor assembly processes.
- Experienced in APQP, SPC, FMEA, DOE, 8D.
- Good problem solving, statistical analysis, and project management skills.
- Able to manage complex technical problems independently.
- Good communication skills in both verbal and written English.
- Experienced in MS software.
Skills: Semiconductor assembly processes, package maturity, APQP, SPC, FMEA
This role has been open 3 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | STMicroelectronics | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 264 | 9358 · 108 employers |
| Median days open | 2 d | 53 d (−51 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: Semiconductor assembly processes, package maturity, APQP, SPC, FMEA
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.