Assembly Handling Systems Development Engineer - Kulim, Malaysia
Originally posted 24 September 2026 by the employer.
About the role
This role involves developing and deploying advanced chip packaging process technology through material handling technology, specifically high accuracy and high-speed pick-n-place systems.
What you'll do
- Develop handling process recipes.
- Design and validate nozzle tooling.
- Address process and equipment issues on the manufacturing floor.
- Test and validate hardware/software upgrades.
- Develop solutions from platform specification to validation, deployment, and proliferation to high volume manufacturing sites.
- Drive improvements in quality, reliability, cost, yield, process stability, productivity, and safety/ergonomics.
What you'll need
- Bachelor's or Master's degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering, or a related STEM field.
- At least 1 year of work experience.
- Fundamental understanding of motion control, high accuracy/speed robotic systems, and vision systems.
- Fundamental understanding of semiconductor devices and packing technology.
Nice to have
- Development and deployment experience in factory automated material handling systems, including Autonomous Mobile Robot (AMR)/Automated Guided Vehicle (AGV), conveyor systems, stockers, automated storage solutions, and manufacturing equipment integration.
- Familiarity with advanced autonomous manufacturing concepts (Level 5 & above automation).
- Strong kinematics / motion control / vision systems background (High speed / high accuracy pick-n-place, 2D vision systems).
- Mechanical design experience (CAD, Solidwork, GD and T).
- Strong understanding of statistical principles, statistical process control (SPC), and Design of Experiments (DOE).
- Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
This role has been open 0 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 177 | 9525 · 109 employers |
| Median days open | 64 d | 58 d (+6 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.